Shape-Memory Polymer Device Design 2017
DOI: 10.1016/b978-0-323-37797-3.00003-8
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Cited by 3 publications
(2 citation statements)
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“…Various grades of commercial materials have been developed according to their use. PDMC18SP is comparable to Mitsubishi’s Diary and DiAPLEX series (polyurethanes, R f : 95 ∼ 99, R r : 84 ∼ 100) and CRG’s Veriflex series (styrene- and epoxy-based resins, R f : 72 ∼ 100, R r : 65 ∼ 98) in terms of shape memory performance . As expected, PTMSP exhibited no shape memory capability because it exists in glassy state over the studied temperature range and thus cannot show rubber elasticity at the source.…”
Section: Resultsmentioning
confidence: 99%
“…Various grades of commercial materials have been developed according to their use. PDMC18SP is comparable to Mitsubishi’s Diary and DiAPLEX series (polyurethanes, R f : 95 ∼ 99, R r : 84 ∼ 100) and CRG’s Veriflex series (styrene- and epoxy-based resins, R f : 72 ∼ 100, R r : 65 ∼ 98) in terms of shape memory performance . As expected, PTMSP exhibited no shape memory capability because it exists in glassy state over the studied temperature range and thus cannot show rubber elasticity at the source.…”
Section: Resultsmentioning
confidence: 99%
“…Maximum SMP recovery stresses, defined as the change in macroscopic stress produced by internal stress changes, generally cannot surpass 10 MPa while SMA recovery stresses commonly reach 500-900 MPa. [28,29] This recovery stress comparison suggests that SMAbased approaches may be better suited for high compression applications, such as mechanical counterpressure spacesuits. [18] However, SMPs offer superior material engineering strain (ε m ), defined as the change in material length in relation to a reference length (ε m,SMP > 100%; ε m,SMA < 8%).…”
Section: Introductionmentioning
confidence: 99%