Materials' Impact on Interconnect Process Technology and Reliability

Hussein, Makarem A.; He, Jun

doi:10.1109/tsm.2004.841832

Cited by 73 publications

(42 citation statements)

References 47 publications

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“…It is assumed here that the limiting current for nitrate ion reduction at copper in acid is determined largely by boundary layer transport of NO À 3 ions. Quite high rates of nitrate reduction were observed, Figure 5, the limiting (or plateau) values being a linear function of the nitrate ion concentration, at least to values of the latter up to 0.3 mol dm ) 3 .…”

Section: The Electrocatalytic Properties Of Copper In Acid Solutionmentioning

confidence: 89%

“…Descriptions of this new copper metallization process (also known as Damascene plating) and the advantages of copper, relative to aluminium, have been widely reported [1][2][3][4][5] and need not be repeated here. However, it is worth noting that while the use of a combination of additives in acidified copper sulphate plating baths is crucial (to achieve voidfree connectors via superfilling or bottom-up growth during electrodeposition) [5,6], it is also acknowledged [7][8][9][10][11][12] that the operation of bath additives is poorly understood.…”

Section: Introductionmentioning

confidence: 99%

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Involvement of a metastable surface state in the electrocatalytic, electrodeposition and bath additive behaviour of copper in acid solution

et al. 2006

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Copper in aqueous sulphuric acid solution at room temperature displays a low level active (metastable) surface state redox transition well within the double layer region, at ca. )0.7±0.1 V (SMSE). The latter is an important feature of this electrode system as it apparently coincides with (a) the transition from activation to transport control in acid sulphate copper plating baths, (b) a major change in the inhibiting properties of several plating bath additives, and (c) the onset/termination potential of electrocatalytic processes, e.g. nitrate reduction, at copper in acid. The nature and influence of this active surface state behaviour, which is assumed to be relevant to Damascene copper plating, is discussed.

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Section: The Electrocatalytic Properties Of Copper In Acid Solutionmentioning

confidence: 89%

Section: Introductionmentioning

confidence: 99%

Involvement of a metastable surface state in the electrocatalytic, electrodeposition and bath additive behaviour of copper in acid solution

et al. 2006

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“…Due to the multi-variate nature and complexity of this problem, very few inverstigations of N3040 Technology, 4 (1) N3029-N3047 (2015) the minimum required ES thickness in a DD patterning process have been reported in the literature. 316 This may be due to the minimum DB thickness exceeding the minimum required ES thickness in most patterning schemes. However, this could change as the DB thickness decreases to 1-2 nm as forecasted by the ITRS.…”

Section: Current Status Of Low-k Db/ccl/es Materials and R And Dmentioning

confidence: 99%

Dielectric Barrier, Etch Stop, and Metal Capping Materials for State of the Art and beyond Metal Interconnects

King

2014

ECS J. Solid State Sci. Technol.

133

115

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Over the past decade, the primary focus for improving the performance of nano-electronic metal interconnect structures has been to reduce the impact of resistance-capacitance (RC) delays via utilizing insulating dielectrics with ever lower values of dielectric permittivity. The integration and implementation of such low dielectric constant (i.e. low-k) materials has been fraught with numerous challenges. For intermetal and interlayer (ILD) low-k dielectrics, these challenges have been largely associated to integration with metal interconnect fabrication processes and well documented and reviewed in the literature. Although equally important, less attention has been given to other low-k dielectrics utilized in metal interconnect structures that are commonly referred to as low-k dielectric barriers (DB), etch stops (ES), and/or Cu capping layers (CCL). These materials present numerous challenges as well for integration into metal interconnect fabrication processes. However, they also have more stringent integrated functionality requirements relative to low-k ILD materials that serve only a basic purpose of electrically isolating adjacent metal lines. In this article, we review the integration challenges and associated integrated functionality requirements for low-k DB/ES/CCL materials with a focus on the current status and future direction needed for these materials to facilitate both Moore's law (i.e. More Moore) and More than Moore scaling.

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“…The electrochemistry of copper in acid solution is of considerable interest with regard to (a) copper electrodeposition as currently employed for interconnect fabrication in the microelectronics industry [1][2][3][4][5] and (b) copper electrocatalysis for the reduction of nitrate ions [6][7][8] and organic nitrocompounds [9][10][11][12], e.g. the conversion of nitrobenzene (NB) (C 6 H 5 NO 2 ) to aniline (C 6 H 5 NH 2 ) and p-aminophenol (p-HOC 6 H 4 NH 2 ) [9].…”

Section: Introductionmentioning

confidence: 99%

Surface active state involvement in electrocatalytic reductions at copper in acid solution

Burke

Sharna

2007

J Appl Electrochem

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The electrocatalytic behaviour of copper in acid is dominated by a metastable state interfacial redox transition which occurs within the double layer region, at ca. À0.7 (±0.1) V (SMSE). The transition in question is apparently based on the presence of low coverage, redox active, copper surface clusters which function as active sites or mediators and thus facilitate electron transfer across the interface; copper in acid exhibits a remarkably high overpotential of ca. 1.2 V for oxygen reduction. The effect of copper plating bath additives on the electrocatalytic properties of copper was surveyed and it was demonstrated that with a compound such as thiourea, the presence in solution of a species such as nitrate, which under additive-free conditions undergoes rapid mediated reduction, exacerbates the surface deactivating effect of the additive.

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Materials' Impact on Interconnect Process Technology and Reliability

Cited by 73 publications

References 47 publications

Involvement of a metastable surface state in the electrocatalytic, electrodeposition and bath additive behaviour of copper in acid solution

Involvement of a metastable surface state in the electrocatalytic, electrodeposition and bath additive behaviour of copper in acid solution

Dielectric Barrier, Etch Stop, and Metal Capping Materials for State of the Art and beyond Metal Interconnects

Surface active state involvement in electrocatalytic reductions at copper in acid solution

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