Materials, interfaces and production techniques for planar solid oxide fuel cells

Feasibility of alternative electrode materials for high temperature CO2 reduction on solid oxide electrolysis cell

“…TiO 2 -doped YSZ showed better interfacial bonding in contact with Ni particles, which suppress the coarsening of the Ni particles [34]. Another study under SOFC operating condition demonstrated that adding a small amount of CeO 2 to the NieYSZ cermet anode improved the tolerance of NieYSZ cermet towards temperature and atmospheric cycling without degradation [37]. Hence, these results suggest that in NieGDC cathode, the mixed conduction of doped ceria enhanced the electrochemical active sites and prevented the coarsening of Ni particles.…”

Low-temperature sintering of lanthanum strontium manganite-based contact pastes for SOFCs

“…Non-negligible losses due to contact resistance between metallic interconnect plates and ceramic electrodes have been observed in planar solid oxide fuel cells (SOFCs), the result of resistive interfacial scale formation as well as low contact area [1][2][3][4]. Contact resistance losses on the anode side are small, where nickel metal pastes and nickel mesh are typically utilized to provide a low-resistance metallurgical bond between the nickel-based anode and a metallic interconnect.…”

Effect of organic additives on the zeta potential of PLZST and rheological properties of PLZST slurries

“…Recently, the thick film ceramic preparation processes, such as, screen printing, tape casting have been used to prepare PZT and related materials. [1][2][3][4][5] Tape casting is a convenient and useful method for the large-scale preparation of ceramic substrates, capacitors, and multilayered structural composites for various applications, such as: Al 2 O 3 , 6,7 AlN 8,9 substrates, BaTiO 3 capacitors, 10,11 solid electrolytes, [12][13][14] solid oxide fuel cells, [15][16][17][18][19][20] or PZT and PZST ceramic sheets. [21][22][23][24][25] In the past, the traditional tape casting focused on organic solvent systems due to their low latent heat of evaporation and low surface tension.…”