Mathematical model-based evaluation methodology for environmental burden of chemical mechanical planarization process

Lee, Hyunseop; Dornfeld, David; Jeong, Haedo

doi:10.1007/s40684-014-0002-7

Cited by 24 publications

(9 citation statements)

References 19 publications

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“…Lee et al [27] proposed a mathematical model-based evaluation methodology to develop a CMP model based on the mechanical contact [28] and kinematic models [29,30] for analyzing the environmental burden caused by CMP. They classified the consumables in the CMP as long lifespan CMP countable and short lifespan CMP countable and defined them as follows.…”

Section: Fig 3 Schematic Of Materials and Energy Flow For Cmp And Cmp Consumablementioning

confidence: 99%

“…Lee et al [27] proposed the environmental burden assessment method to obtain the process time required to remove the targeted film thickness through the MRR model. Then, the electrical energy consumption, slurry consumption, and UPW consumption during the process time are calculated and converted to CDE (Fig.…”

Section: Fig 3 Schematic Of Materials and Energy Flow For Cmp And Cmp Consumablementioning

confidence: 99%

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Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review

Lee

Kim

Jeong

2021

Int. J. of Precis. Eng. and Manuf.-Green Tech.

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Chemical mechanical polishing (CMP) is an essential planarization process for semiconductor manufacturing. The application of CMP has been increasing in semiconductor fabrication for highly integrated devices. Recently, environmental burden caused by the CMP process was assessed because of interest in the global environment. In this study, the previously reported impacts of CMP on the environment and studies conducted on developing various methods to reduce environmental burden are reviewed. In addition to analyzing the impacts of CMP, this paper introduces a method for treating CMP wastewater and improving the material removal efficiency through the improvement of CMP consumables. Finally, the authors review research on hybridization of the CMP process and discuss the direction in which CMP technology will progress to improve sustainability in the future.

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Section: Fig 3 Schematic Of Materials and Energy Flow For Cmp And Cmp Consumablementioning

confidence: 99%

Section: Fig 3 Schematic Of Materials and Energy Flow For Cmp And Cmp Consumablementioning

confidence: 99%

Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review

Lee

Kim

Jeong

2021

Int. J. of Precis. Eng. and Manuf.-Green Tech.

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“…This manufacturing involves the development of products through processes that are environmentally friendly, energy and resources efficient. Sustainable manufacturing has been defined as development of products via processes with optimal energy and natural resources conservation, and minimal negative environmental consequences for employees, communities, and consumers ( Ball et al., 2009 ; Branker et al., 2011 ; Loglisci et al., 2013 ; Lee et al., 2014 ; Yi et al., 2015 ; Gupta et al., 2016 ; Li et al., 2017 ). The quest to develop smart products which will meet functional requirements using emerging materials within a short manufacturing cycle time has led to increase in energy requirement of the manufacturing processes with environmental impact and cost consequences ( Priarone, 2016 ).…”

Section: Introductionmentioning

confidence: 99%

Review of life cycle models for enhancing machine tools sustainability: lessons, trends and future directions

Daniyan

Mpofu

Ramatsetse

et al. 2021

Heliyon

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The life cycle models are critical in the assessment of the performance of a product from the design phase to its end of life (EoL). With the quest for manufacturing sustainability with respect to energy, process, material, and environment friendliness as well as the clamour for circular economy which emphasizes zero tolerance for waste, there is a need for a critical review of the life cycle of machine tool employed for machining operations and product development. The objective of this study is to evaluate the efficient way of managing the machine tools throughout its lifecycle. Several studies have been conducted in analysing the life cycle of the machine tools and different strategies were employed for its design, manufacture, use, maintenance and recovery at the end of life. The common approach to ensure environmental sustainability was established when comparing the literature studied. From the articles reviewed 60% applied life cycle assessment (LCA) methodology to reduce energy consumption and enhance environmental sustainability, while 40% employed other assessment tools. In this study an integrated life cycle and cyber physical machine tool model is proposed.

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“…They adopt our previously reported material removal rate model for CMP and modified it to incorporate the effect of the slurry flow rate and process temperature. The results showed that slurry consumption strongly impacts the carbon dioxide equivalents of the CMP process [9]. Yang et al proposed a chip-scale CMP model that is based on the Greenwood-Williamson theory.…”

Section: Introductionmentioning

confidence: 99%

Material removal mechanism of copper chemical mechanical polishing with different particle sizes based on quasi-continuum method

Zhu

et al. 2017

Friction

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Abstract:In this paper, the material removal mechanism of copper chemical mechanical polishing was studied by the quasicontinuum method that integrated molecular dynamics and the finite element method. By analyzing the abrasive process of different particle sizes on single crystal copper, we investigated the internal material deformation, the formation of chips, the stress distribution, and the change of cutting force. Results showed that shear band deformation was generated along the cutting direction at approximately 45° inside the workpiece material. The deformation was accompanied by dislocations and sliding phenomena in the shear band region. Smaller abrasive particle size led to poor quality of the workpiece, while a larger particle size led to better quality. However, larger particle size resulted in greater plastic deformation and deeper residual stress inside the workpiece. Size change of abrasive particles had little effect on the tangential cutting force.

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Mathematical model-based evaluation methodology for environmental burden of chemical mechanical planarization process

Cited by 24 publications

References 19 publications

Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review

Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review

Review of life cycle models for enhancing machine tools sustainability: lessons, trends and future directions

Material removal mechanism of copper chemical mechanical polishing with different particle sizes based on quasi-continuum method

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