Mathematical modelling and optimization of the electroplating process with a rotating cathode to reduce the non-uniformity of the coating thickness

Abstract

The article is devoted to the development of an approach to improving the electroplating uniformity on the cathode surface, rotating around its axis, using a figured anode. A mathematical model of a stationary process with distributed coordinates, based on the equations of theoretical electrochemistry, has been developed for this approach. The problem for optimizing the anode shape according to the criterion for minimizing the non-uniformity of the deposited coating on the rotating cathode is formulated. The results of solving this problem are demonstrated on the example of the Zinc plating. Possible improvements to improve the accuracy of the calculation results for the developed mathematical model are given in the conclusion of the article.

Optimization of the anode shape for the electroplating coating on long thin-walled detail taking into account the ohmic potential drop

“…The coating thickness obtained without taking into account the ohmic potential drop by length of the electrodes turned out to be 5.95-8.6% more than the coating thickness obtained taking into account the ohmic potential drop. This is due to the traditional assumption of the electrode potentials constancy when simulating electroplating processes [9,10].…”

“…In general, the iterative process of calculating the discrete values of the electrode potentials included in the boundary conditions (10) and (11) is described as:…”

Modelling of coating thickness distribution on the edges of a moving cathode during electrogalvanizing

“…In this work, the authors give the theoretical basis to the RWE, through process modeling and simulation tools to deeply understand how experimental conditions affect the coating thickness distribution on the edge of the moving cathode. Different modeling strategies have been proposed to simulate and optimize the electroplating process [12,13], in particular COMSOL Multiphysics software with the electrodeposition module allows the modeling of complex geometries. Among others, Robinson and Free [14] have modeled copper electrodeposition using cells of different geometries (a Hull cell and other with four cathodes); the authors presented an empirical equation to predict deposit thickness, by fitting COMSOL results.…”