“…In this work, the authors give the theoretical basis to the RWE, through process modeling and simulation tools to deeply understand how experimental conditions affect the coating thickness distribution on the edge of the moving cathode. Different modeling strategies have been proposed to simulate and optimize the electroplating process [12,13], in particular COMSOL Multiphysics software with the electrodeposition module allows the modeling of complex geometries. Among others, Robinson and Free [14] have modeled copper electrodeposition using cells of different geometries (a Hull cell and other with four cathodes); the authors presented an empirical equation to predict deposit thickness, by fitting COMSOL results.…”