1996
DOI: 10.1007/978-3-662-03225-1
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Matter and Methods at Low Temperatures

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Cited by 125 publications
(75 citation statements)
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“…Since this cooling mechanism does not depend on the internal structure of the species (unlike laser cooling), buffer gas cooling can be applied to nearly any atom or small molecule [4], and certain large molecules [57]. Helium maintains a sufficient vapor pressure down to a few hundred mK [4,58], and the typical helium-molecule elastic cross section [4] of ∼ 10 −14 cm 2 allows buffer gas cool- ing and trap loading to be realized with modest cell sizes (few × few × few cm 3 ). Buffer gas cooling (using both helium and neon) has been used to create beams, load magnetic traps, and perform spectroscopy in a cold buffer gas cell [4].…”
Section: B Buffer Gas Cooling and Beam Productionmentioning
confidence: 99%
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“…Since this cooling mechanism does not depend on the internal structure of the species (unlike laser cooling), buffer gas cooling can be applied to nearly any atom or small molecule [4], and certain large molecules [57]. Helium maintains a sufficient vapor pressure down to a few hundred mK [4,58], and the typical helium-molecule elastic cross section [4] of ∼ 10 −14 cm 2 allows buffer gas cool- ing and trap loading to be realized with modest cell sizes (few × few × few cm 3 ). Buffer gas cooling (using both helium and neon) has been used to create beams, load magnetic traps, and perform spectroscopy in a cold buffer gas cell [4].…”
Section: B Buffer Gas Cooling and Beam Productionmentioning
confidence: 99%
“…Fortunately there is a solution, which is to use activated charcoal as a cryopump [58]. When cooled to 10 K, activated charcoal becomes a cryopump for helium with up to several l s −1 pumping speed per cm 2 of charcoal, and can hold almost 1 STP liter of helium per gram (though these values are highly dependent on temperature, and other parameters [58]).…”
Section: Cryopumpsmentioning
confidence: 99%
“…These are mostly associated with its low thermal conductivity. Below the λ-point LHe is a nearly perfect thermal conductor [14], therefore there is no thermal convection or boiling, so the laser beam going through it is undisturbed. Normal liquid helium, however, is a very poor thermal conductor (κ ≈ 2×10 −4 W/cm·K).…”
mentioning
confidence: 99%
“…If this identification is appropriate, it would be related to the thermal boundary resistance and heat capacity C by t 2 = R C B , where R B is the thermal boundary resistance. The thermal boundary resistance between copper and solid 4 He is taken as [54] / , where A is the contact surface area. The solid line in Fig.…”
Section: Dynamic Thermal Responsementioning
confidence: 99%
“…The calculated t 2 captures the qualitative but not the detailed temperature dependence. Since the thermal boundary resistance at the copper/solid 4 He interface is smaller than at the copper/ He II interface [54] by a factor of seven, t 2 is expected to be smaller when the cell is filled with solid 4 He (the heat capacity of solid 4 He is greater than that of He II by only a factor of two). This discrepancy has not been resolved.…”
Section: Dynamic Thermal Responsementioning
confidence: 99%