MCM-C cost comparison: Fodel(R) vs. Diffusion Patterning/sup TM/ vs. Green Tape/sup TM/

Page, J.P.; Amey, Daniel I.; Draudt, Richard R.; Inman, M. C.; Horowitz, S. J.

doi:10.1109/icmcm.1997.581147

Proceedings 1997 International Conference on Multichip Modules

DOI: 10.1109/icmcm.1997.581147

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MCM-C cost comparison: Fodel(R) vs. Diffusion Patterning/sup TM/ vs. Green Tape/sup TM/

J.P. Page

Daniel I. Amey²,

Richard R. Draudt³

et al.

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MCM-C cost comparison: Fodel(R) vs. Diffusion Patterning/sup TM/ vs. Green Tape/sup TM/

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