Measurement issues in LED characterization for Delphi4LED style combined electrical-optical-thermal LED modeling

Hantos, Gusztáv; Hegedüs, János; Bein, Marton C.; Gaal, Lajos; Farkas, G.; Sárkány, Zoltán; Ress, S.; Poppe, A.; Rencz, M.

doi:10.1109/eptc.2017.8277493

Cited by 9 publications

(13 citation statements)

References 7 publications

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“…In the bottom-up modular approach, the modelling starts from a multi-domain model of LED chips [5][6][7], followed by compact thermal models of the LED packages, modules (orange framed items in Figure 1), and finally, luminaires [8,9]. Details of the compact modelling of the 3D thermal environment of LED chips (package, substrate, luminaire with optics) are provided in other publications, such as [8,10,11].…”

Section: The Context Of This Workmentioning

confidence: 99%

“…The results of our academic approach that was the starting point of our most recent developments are summarized in [5]. The steps of the evolution of our models from this academic study towards our present, industrial application oriented models were published in our recent conference papers [6,7]. In the subsequent sections of this paper, we report the latest achievements in chip level modelling of LEDs with a focus on the thermally influenced electrical and optical behavior treated in a self-consistent manner, with the needs of commercial implementation for industrial applications in mind, in a closer context as presented in Section 1.1.…”

Section: The Wider Backgroundmentioning

confidence: 99%

“…In the model represented by Figure 5b, either the region around the peak efficacy or the high current range was modeled at better precision. This was resolved by inserting a series resistance, R R , in the "radiative branch" of the LED model as shown in Figure 5c [6,7]. each current component, the charge carriers are subject to one type of recombination process only.…”

Section: The Basic Concept: Splitting the Total Forward Current Into mentioning

confidence: 99%

“…Both the radiative and the dissipative current components can be described by the Shockley equation [5]. (c) LED model with added series resistance in the radiative branch, accounting for light decay at high currents [6,7].…”

Section: The Basic Concept: Splitting the Total Forward Current Into mentioning

confidence: 99%

“…That is, the voltages of components in series must be totaled, and the current is split into and at the single internal node with a voltage. Regarding the branch equations, both diodes behave as (c) LED model with added series resistance in the radiative branch, accounting for light decay at high currents [6,7].…”

Section: Model Equations At a Fixed Reference Temperature In The Cmentioning

confidence: 99%

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Multi-Domain Modelling of LEDs for Supporting Virtual Prototyping of Luminaires

et al. 2019

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This paper presents our approaches to chip level multi-domain LED (light emitting diode) modelling, targeting luminaire design in the Industry 4.0 era, to support virtual prototyping of LED luminaires through luminaire level multi-domain simulations. The primary goal of such virtual prototypes is to predict the light output characteristics of LED luminaires under different operating conditions. The key component in such digital twins of a luminaire is an appropriate multi-domain model for packaged LED devices that captures the electrical, thermal, and light output characteristics and their mutual dependence simultaneously and consistently. We developed two such models with this goal in mind that are presented in detail in this paper. The first model is a semi analytical, quasi black-box model that can be implemented on the basis of the built-in diode models of spice-like circuit simulators and a few added controlled sources. Our second presented model is derived from the physics of the operation of today’s power LEDs realized with multiple quantum well heterojunction structures. Both models have been implemented in the form of visual basic macros as well as circuit models suitable for usual spice circuit simulators. The primary test bench for the two circuit models was an LTspice simulation environment. Then, to support the design of different demonstrator luminaires of the Delphi4LED project, a spreadsheet application was developed, which ensured seamless integration of the two models with additional models representing the LED chips’ thermal environment in a luminaire. The usability of our proposed models is demonstrated by real design case studies during which simulated light output characteristics (such as hot lumens) were confirmed by luminaire level physical tests.

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