Measurement of die stresses in microprocessor packaging due to thermal and power cycling

Roberts, Jordan C.; Motalab, Mohammad; Hussain, Safina; Suhling, Jeffrey C.; Jaeger, R.C.; Lall, Pradeep

doi:10.1109/ectc.2012.6248918

Cited by 10 publications

(1 citation statement)

References 17 publications

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“…1,2 Thermal effects are also as a major cause of deterioration in electronic devices. 3,4 It is quite challenging to design a packaging structure achieving good acoustic attenuation, as well as good thermal characteristics for an enclosed device. [5][6][7] An open-through rigid substructure is considered as one possible strategy to meet such specifications.…”

Section: Introductionmentioning

confidence: 99%

Sound Attenuation Study of Micro-Scale Acoustic Package

Chang¹,

Flowers²,

Dean³

et al. 2020

The International Journal of Acoustics and Vibration

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Certain microelectromechanical systems (MEMS), particularly MEMS gyroscopes, are notably susceptible to high power acoustic noise, especially when the noise is at or near its resonant frequency. A micro scale open-through dual expansion chamber (ODEC) array package with a continuous transmission loss (TL) in a wide frequency range is proposed to diminish the impact of such noise on the performance of MEMS gyroscopes. An analytical model based on planar wave propagation in stationary air has been developed with the consideration of the thermo-acoustic effect near the inner rigid boundary regarding small scale. Experiments with ODEC groups and control groups (non-ODEC) samples have been conducted to verify the model and compare the performances. The ODECs perform in the manner of low-pass filters and both the experimental and the analytical results exhibit greater TL in the higher frequency ranges as compared to the corresponding control samples. In addition, the resonance effects of the ODEC itself are also experimentally observed to be a key factor in influencing the TL.

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