Abstract:Determination of geometric parameters for thin film materials
has
always been a critical concern in scientific research. This paper
proposes a novel approach for high-resolution and nondestructive measurement
of nanoscale film thickness. In this study, the neutron depth profiling
(NDP) technique was employed to accurately measure the thickness of
nanoscale Cu films, achieving an impressive resolution of up to 1.78
nm/keV. The measurement results exhibited a deviation from the actual
thickness of less than 1%, … Show more
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