2007
DOI: 10.1016/j.microrel.2007.01.011
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Measurement of the hot carrier damage profile in LDMOS devices stressed at high drain voltage

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Cited by 6 publications
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“…This variation affects the RF performances. According to the literature [14][15][16], the degradation cause for RF N-LDMOS technology is attributed to hot electron-induced interface state generation [16][17][18]. May be state interface Si/SiO 2 between drain and gate are responsible of this phenomenon.…”
Section: Resultsmentioning
confidence: 99%
“…This variation affects the RF performances. According to the literature [14][15][16], the degradation cause for RF N-LDMOS technology is attributed to hot electron-induced interface state generation [16][17][18]. May be state interface Si/SiO 2 between drain and gate are responsible of this phenomenon.…”
Section: Resultsmentioning
confidence: 99%