1966
DOI: 10.1115/1.3670907
|View full text |Cite
|
Sign up to set email alerts
|

Measurement of the Stresses Set Up in a Resin Bonded Diamond Grinding Wheel While Grinding Harmet G6 Tungsten Carbide

Abstract: This report describes the work which has been done in measuring stresses developed during diamond grinding, and summarizes the preliminary phases of this investigation. The technical problems associated with this type of measurement are formidable, and a great deal of work has been put into developing a technique which works very well indeed. It is now possible to identify and measure four of the strains developed in a peripheral diamond grinding wheel during use. These are the radial compression, tangential d… Show more

Help me understand this report

This publication either has no citations yet, or we are still processing them

Set email alert for when this publication receives citations?

See others like this or search for similar articles