Measurement of Transient Thermal Stresses Using the 5-Element Strain Gage

Abstract

The transient thermal stresses on the 5-element strain gage are measured both for the disk and the circular plate with holes, and under a partial heating by molten metal on one face. The results are in good agreement with the theoretical solutions. The effects of the disk thickness and the interference with holes on the thermal stresses have been investigated.

Stress Intensity Factors of Multiple Radial Edge Cracks at a Circular Hole in an Infinite Plate Due to Rotating Heat Source

“…For the case of thermal stress measurement, Koizumi [14] has developed a new technique for measuring transient thermal stresses using the strain gage to which the thermocouple is attached. Goshima et al [15][16] confirmed the adequacy of this technique by applying this technique to the measurement of transient thermal stresses of various disks under different heating conditions. In this article, we extend this technique to the measurement of the stress intensity factor due to transient thermal stresses with reference to the above strain-gage method for stress intensity factors [9][10][11][12][13].…”