2021 22nd International Conference on Electronic Packaging Technology (ICEPT) 2021
DOI: 10.1109/icept52650.2021.9568152
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Measurement Process Optimization in Using Lock-in Thermography for Fault Localization of CoWos Packages

Shuanshe Chao
1
,
Na Mei
2
,
Xinyi Lin
3
et al.
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