Measurement techniques for the evaluation of thick‐film materials used in wireless applications

Tian, Zhong‐Qun; Free, C.E.

doi:10.1108/13565360110391600

Cited by 2 publications

(2 citation statements)

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“…This type of characterization can be carried out on transmission lines on substrates (e.g., microstrip/stripline ring resonator [2] or T-resonator), dielectric resonators, or with nonmetallized substrates in resonant cavities such as the split post resonator [6].…”

Section: Introductionmentioning

confidence: 99%

“…For transmission/reflection measurement, the unknown dielectric material is used in transmission lines (e.g., as a substrate, or to fill a waveguide or a coaxial line) or placed in front of an open-ended coaxial line. An overview of substrate related measurement methods is given in [2]. Various concepts to determine the complex permittivity of liquids with fully or partially filled structures such as coaxial lines [3], waveguides [4], or triplate transmission lines [5] have been proposed.…”

Section: Introductionmentioning

confidence: 99%

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Wide Band Measurement of Dielectric Properties of Electronic Assembly Materials Inside an LTCC Fluidic Structure

Müller

2014

Journal of Microelectronics and Electronic Packaging

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AbstractÀAssembly materials such as underfillers or glob top epoxies are typically not specified regarding their dielectric properties for frequencies higher than 1 MHz. However, their behavior should be known for a wider frequency range in order to implement the appropriate parameters for RF and microwave simulations and designs. Typical methods to measure permittivity and loss tangent are based on parallel plate capacitor measurement with an impedance or network analyzer (up to about 1 GHz), S-parameter measurement of filled waveguides, coaxial transmission lines, or resonance methods (e.g., split post resonator, slit cavity resonator, ring resonator, open resonator). Most of these methods require specific sophisticated sample preparation. The paper describes a novel method based on suspended or inverted microstrip evaluation in a 3D LTCC structure. Suspended and inverted microstrip lines have lower insertion losses than standard microstrip lines due to the air gap between the line and the ground plane (reduced dielectric losses). Low loss structures are necessary to be able to measure low loss dielectrics. Such suspended or inverted microstrip lines can be easily achieved in LTCC by implementing a cavity structure. Inlets and outlets allow for the cavity to be filled with fluids after an initial S-parameter measurement of line properties (i.e., impedance, insertion loss, phase velocity). Measuring is repeated once the assembly material is cured. The change in impedance, phase velocity, and insertion contains the information about the material under test. Its properties are derived by curve fitting methods with a 3D electromagnetic field simulator. It is also possible to implement line resonators instead of through lines. In the latter case, the resonant frequency shift and the quality factor contains the material information. The procedure is demonstrated on a multilayer LTCC substrate based on low loss DP 9k7 and a commercial underfill material.

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Section: Introductionmentioning

confidence: 99%