Measuring heat transfer coefficient in convection reflow ovens

Illés, Béla

doi:10.1016/j.measurement.2010.05.004

Cited by 27 publications

(12 citation statements)

References 16 publications

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“…Relative movement is what ought to happen as the circuit is transported and it allows the process of heat convection [5]. At the same time, the air in the furnace itself produces heat convection.…”

Section: Heat Convection Modelmentioning

confidence: 99%

Research on Furnace Temperature Curve Based on Heat Convection and Heat Radiation

et al. 2021

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Insights into the mechanism of reflow soldering temperature curve, a mathematical model of the temperature change of the circuit board surface is established. The heat transfer methods, heat radiation and heat convection is analyzed in detail. The curve of air temperature inside the reflow furnace is solved by establishing an one-dimensional heat conduction model and fitting coefficients. The heat radiation received by the circuit board mainly comes from the small temperature zone. Depending on the area where the circuit board is located, heat radiation is itemized into 3 types: heat radiation in the gap, the temperature zone and the adjacent temperature zone of the area before and after the furnace. The impacts of heat radiation is weighted and analyzed by relative distance. For coefficients, analyzing and fitting is further discussed.

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Section: Heat Convection Modelmentioning

confidence: 99%

Research on Furnace Temperature Curve Based on Heat Convection and Heat Radiation

et al. 2021

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“…An example can be seen in Fig. 11 where the efficiency of the nozzle-lines can be compared in a reflow oven at L/2.5 measuring height (Illés, 2010). This visualization method ensures that we get sufficient view of the changes of h parameter in the oven.…”

Section: Study Of the Measured Heat Transfer Coefficientsmentioning

confidence: 99%

Thermal Characterization of Solid Structures during Forced Convection Heating

Illés¹,

Harsányi²

2011

Heat Transfer - Mathematical Modelling, Numerical Methods and Information Technology

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Section: Introductionmentioning

confidence: 99%

“…The average heat-transfer coefficient (h avg ) was calculated using experimental equations for multiple impinging jets. However, the experimental results obtained by Illé s [4], [5] showed that the heat transfer coefficient (h) was inconsistent within the reflow oven.Thus, to investigate the thermal response and thermal stress within the BGA assembly, undertaking a thermal investigation at the board-level BGA assembly is necessary. This investigation can be accomplished by considering the conditions in the reflow oven and the board configuration.…”

mentioning

confidence: 99%

Simulation Investigations on Fluid/Structure Interaction in the Reflow Soldering Process of Board-Level BGA Packaging

Abdullah¹

2013

IJCTE

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Abstract-The objective of the present study is to develop a Fluid/Structure Interaction model of a board-level Ball Grid Array (BGA) assembly for an infrared-convection reflow oven. The infrared-convection reflow oven is modeled in Computational Fluid Dynamic (CFD) software while the structural heating BGA package simulation is done using Finite Element Method (FEM) software. Both software applications are coupled bidirectional using the Multi-physics Code Coupling Interface (MpCCI). The simulation thermal profile is compared with the experiment thermal profile, and they were found to be in good conformity. The simulated flow fields show that the convection mode in an infrared-convection reflow oven played minor effect on heat transfer to the printed circuit board (PCB). The dominant heat transfer mode in an infrared-convection reflow oven is the radiation mode from a quartz heating tube. From the simulation results, the PCB near the edges or corners tended to heat up first at preheating, soaking and reflow stages. The PCB and component experience larges temperature difference in preheating stage. This situation runs the risk of an excessive board warpage. In addition, the maximum von-Mises stress is trapped in the interfaces between solder joint and die, which intend to form the nucleation of initial solder joint crack. This guideline is very useful for the accurate control of temperature and thermal stress distributions within components and PCB, which is one of major requirements to achieve high reliability of electronic assemblies.Index Terms-Ball grid array assembly, infrared-convection reflow oven, computational fluid dynamic, finite element method. I. INTRODUCTIONReflow soldering process has been affected by miniaturization of electronic packages and complicated thermal-mechanical design of a printed circuit board (PCB) assembly. Additional challenge is presented with environmental concerns propelling a rising trend toward lead-free soldering. A lead-free solder requires a narrower range of flow temperatures and workable melt compared with a lead-based solder. Using an inadequate reflow profile may not only result in a high level of thermal stress in the package, but may also result in excessive PCB warpage [1]. Those defects can then result in significant reliability issues in the electronic industry. In recent years, a simulation tool for the reflow soldering process greatly helps the electronic manufacturing industry [1]. Therefore, a prediction of the thermal response of the soldering process is crucial for initial parameter design. The popular thermal response analysis at the package level is based on the finite-element method (FEM). Shen et al. [2] and Inoue and Koyanagawa [3] built the FEM model to obtain the temperature distribution of a ball grid array (BGA) package for the reflow process. The average heat-transfer coefficient (h avg ) was calculated using experimental equations for multiple impinging jets. However, the experimental results obtained by Illé s [4], [5] showed that the heat transfe...

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Measuring heat transfer coefficient in convection reflow ovens

Cited by 27 publications

References 16 publications

Research on Furnace Temperature Curve Based on Heat Convection and Heat Radiation

Research on Furnace Temperature Curve Based on Heat Convection and Heat Radiation

Thermal Characterization of Solid Structures during Forced Convection Heating

Simulation Investigations on Fluid/Structure Interaction in the Reflow Soldering Process of Board-Level BGA Packaging

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