Measuring nanograins of 50nm-thick metallization layer using a new approach of EBSD pattern matching

Wu, Jiang; Choo, Eugene; Spasevski, Lucia

doi:10.1109/ipfa58228.2023.10249056

2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2023

DOI: 10.1109/ipfa58228.2023.10249056

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Measuring nanograins of 50nm-thick metallization layer using a new approach of EBSD pattern matching

Jiang Wu,

Eugene Choo,

Lucia Spasevski

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Measuring nanograins of 50nm-thick metallization layer using a new approach of EBSD pattern matching

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References 21 publications

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