Handbook of Silicon Based MEMS Materials and Technologies 2020
DOI: 10.1016/b978-0-12-817786-0.00037-2
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Measuring oxygen and bulk microdefects in silicon

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“…The mechanism of B-defect transforming by annealing needs to be further clarified. 28,29 HCl vapor-phase etching, 30 or called "gas decoration," as a kind of highly selective dry etch, can expose nano-scale oxygen precipitates near the wafer surface. I.e.…”
mentioning
confidence: 99%
“…The mechanism of B-defect transforming by annealing needs to be further clarified. 28,29 HCl vapor-phase etching, 30 or called "gas decoration," as a kind of highly selective dry etch, can expose nano-scale oxygen precipitates near the wafer surface. I.e.…”
mentioning
confidence: 99%