The mobility of potassium ions in a molding compound designed for electronic device insulation has been investigated by a charge attachment induced transport (CAIT) experiment. Two different transport pathways have been identified, i.) through the bulk of the sample and ii.) along boundaries of silica grains embedded in the organic components of the molding compound. The corresponding diffusion coefficients for K+ transport are DB = 1.8 × 10−21 cm2 s−1 for the bulk and DGB = 5.4 × 10−20 cm2 s−1 for the grain boundary. The effective activation energy for charge carrier transport amounts to 1.57 eV.