Measuring the Thickness of Metal Coatings: A Review of the Methods

Giurlani, Walter; Berretti, Enrico; Innocenti, Massimo; Lavacchi, Alessandro

doi:10.3390/coatings10121211

Cited by 56 publications

(37 citation statements)

References 191 publications

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“…These phase images represent the delay of the oscillation of the cantilever in tapping mode. The phase signal is sensitive to different material-related properties like composition, stiffness/softness and viscoelastic properties [ 57 ]. These patches on eADF4(C16)-RGD, eADF4(Ω16) and eADF4(Ω16)-RGD films ( Fig.…”

Section: Resultsmentioning

confidence: 99%

Designing of spider silk proteins for human induced pluripotent stem cell-based cardiac tissue engineering

Esser

Trossmann

Lentz

et al. 2021

Materials Today Bio

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Materials made of recombinant spider silk proteins are promising candidates for cardiac tissue engineering, and their suitability has so far been investigated utilizing primary rat cardiomyocytes. Herein, we expanded the tool box of available spider silk variants and demonstrated for the first time that human induced pluripotent stem cell (hiPSC)-derived cardiomyocytes attach, contract, and respond to pharmacological treatment using phenylephrine and verapamil on explicit spider silk films. The hiPSC-cardiomyocytes contracted for at least 14 days on films made of positively charged engineered Araneus diadematus fibroin 4 ( eADF4(κ16)) and three different arginyl-glycyl-aspartic acid (RGD)-tagged spider silk variants (positively or negatively charged and uncharged). Notably, hiPSC-cardiomyocytes exhibited different morphologies depending on the spider silk variant used, with less spreading and being smaller on films made of eADF4(κ16) than on RGD-tagged spider silk films. These results indicate that spider silk engineering is a powerful tool to provide new materials suitable for hiPSC-based cardiac tissue engineering.

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Section: Resultsmentioning

confidence: 99%

Designing of spider silk proteins for human induced pluripotent stem cell-based cardiac tissue engineering

Esser

Trossmann

Lentz

et al. 2021

Materials Today Bio

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“…Equivalent metal film thickness determination with EDS spectra was made possible by applying the K-ratio method [43,44]. Selecting a particular X-ray emission signal of an element (in this case Kα for copper and Lα for palladium) in the EDS spectra, the ratio between the area of this signal derived from the metal layer with a specific thickness and the one derived from the bulk metal is called the K-ratio.…”

Section: Methodsmentioning

confidence: 99%

“…Selecting a particular X-ray emission signal of an element (in this case Kα for copper and Lα for palladium) in the EDS spectra, the ratio between the area of this signal derived from the metal layer with a specific thickness and the one derived from the bulk metal is called the K-ratio. In this case NIST DTSA-II software [45] was used to simulate the EDS spectra of different palladium films with known thicknesses using a Monte Carlo approach [43,44], applying the work parameters of the Hitachi SEM used for the real samples. The calibration curve obtained from the simulated K-ratios vs. standard metal film thickness was used to interpolate the K-ratio values obtained from real palladium films with unknown thicknesses.…”

Section: Methodsmentioning

confidence: 99%

“…The EDS spectra of the specimens made of copper with various thicknesses of palladium were simulated using NIST DTSA-II software. From the spectra, the K-ratio was calculated to build a calibration curve (Figure 2) [43,44]. K-ratios were defined as the ratio between the peak intensity (X-ray counts) for the element of interest in the sample and the peak intensity of the pure element at the same energy.…”

Section: Palladium Displacement Plating Characterizationmentioning

confidence: 99%

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Exploiting the Combination of Displacement and Chemical Plating for a Tailored Electroless Deposition of Palladium Films on Copper

et al. 2021

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Various formulations for electroless deposition, to obtain continuous nanometre-sized and micrometre-sized films of palladium on copper, were compared. We deposited ultrathin films using displacement plating formulations. We obtained continuous films with an equivalent thickness between 6 and 22 nm, measured by exploiting the K-ratio method with SEM-EDS of Pd layers. The Pd films obtained in this step of the work represent a cost-effective catalytic substrate. As a second step, we selected chemical plating as the procedure to obtain palladium films with a thickness in the micrometre range. An ammonia-based Pd chemical plating bath represent one of the most effective chemical plating formulations. To prevent copper substrates from being damaged by ammonia, displacement plating with palladium was also applied as a pre-treatment to make the use of these plating baths a viable way to obtain thicker palladium coatings. Palladium films showing good adherence, compact morphology, and a thickness over 1.5 μm were obtained, proving that the combination of two different electroless techniques was the key to develop a sustainable procedure for micrometre-sized palladium coatings, which could substitute electroplating of Pd in galvanic industry for decorative applications.

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“…The Cu 2+ ions were reduced by an electrochemical one-step process on the polymer coated substrates in an acidic electrolyte solution (1.5 M H 2 SO 4 and 0.5 M CuSO 4 , pH ranging between 1 and 1.5). Potentiostatic and galvanostatic methods were both investigated, exploring different parameters combinations, in order to obtain a uniform layer of copper with a thickness between 1 and 4 µm [49,50]. In particular, the copper depositions on PEDOT/Pd, PEDOT/Au and PEDOT/ITO were performed at −0.8 V for 300 s, −0.007 A for 600 s and −0.9 V for 600 s, respectively.…”

Section: Copper Electrodepositionmentioning

confidence: 99%

Electrodeposition of Cu on PEDOT for a Hybrid Solid-State Electronic Device

et al. 2021

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Conductive polymers are nowadays attracting great attention for their peculiar mechanical, electrical and optical proprieties. In particular, PEDOT can be used in a wide range of innovative applications, from electroluminescent devices to photovoltaics. In this work, the electrochemical deposition of 3,4 ethylenedioxythiophene (EDOT) was performed on various substrates (ITO, thin films of gold and palladium on silicon wafers) by means of both potentiostatic and potentiodynamic techniques. This was intended to further expand the applications of electrochemically deposited PEDOT, particularly regarding the preparation of thin films in tight contact with electrode surfaces. This allows one to obtain systems prone to be used as electrodes in stacked devices. Chronoamperometric experiments were performed to study the nucleation and growth process of PEDOT. SEM, ESEM and AFM analysis allowed the characterization of the morphology of the polymeric films obtained. Raman and visible spectroscopy confirmed the high-quality of the coatings on the different substrates. Then, the PEDOT films were used as the base material for the further electrodeposition of a copper layer. In this way, a hybrid electronic device was obtained, by using electrochemical methods only. The high conductivity and ohmic behavior of the device were confirmed over a wide range of frequencies with electrical impedance spectroscopy analysis.

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Measuring the Thickness of Metal Coatings: A Review of the Methods

Cited by 56 publications

References 191 publications

Designing of spider silk proteins for human induced pluripotent stem cell-based cardiac tissue engineering

Designing of spider silk proteins for human induced pluripotent stem cell-based cardiac tissue engineering

Exploiting the Combination of Displacement and Chemical Plating for a Tailored Electroless Deposition of Palladium Films on Copper

Electrodeposition of Cu on PEDOT for a Hybrid Solid-State Electronic Device

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