Measuring thermal conductivity of CVD diamond and diamond-like films on silicon substrates by holographic interferometry

Leung, K. M.; Cheung, Albert C.; Liu, B.C.; Woo, H.K.; Sun, Changzheng; Shi, Xuejie; Lee, S.T.

doi:10.1016/s0925-9635(99)00027-8

Cited by 31 publications

(11 citation statements)

References 2 publications

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“…Similar values of thermal conductivity are typical also for polycrystalline diamond films with crystal size of 3–5 nm; indeed, they are 12 W/(m·K) [34], 13 W/(m·K) [96], and 4.5 to 13.7 W/(m·K) [97]. …”

Section: Composites Fabricated By High-pressure High-temperature supporting

confidence: 60%

Thermal Conductivity of Diamond Composites

2009

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A major problem challenging specialists in present-day materials sciences is the development of compact, cheap to fabricate heat sinks for electronic devices, primarily for computer processors, semiconductor lasers, high-power microchips, and electronics components. The materials currently used for heat sinks of such devices are aluminum and copper, with thermal conductivities of about 250 W/(m·K) and 400 W/(m·K), respectively. Significantly, the thermal expansion coefficient of metals differs markedly from those of the materials employed in semiconductor electronics (mostly silicon); one should add here the low electrical resistivity metals possess. By contrast, natural single-crystal diamond is known to feature the highest thermal conductivity of all the bulk materials studied thus far, as high as 2,200 W/(m·K). Needless to say, it cannot be applied in heat removal technology because of high cost. Recently, SiC- and AlN-based ceramics have started enjoying wide use as heat sink materials; the thermal conductivity of such composites, however, is inferior to that of metals by nearly a factor two. This prompts a challenging scientific problem to develop diamond-based composites with thermal characteristics superior to those of aluminum and copper, adjustable thermal expansion coefficient, low electrical conductivity and a moderate cost, below that of the natural single-crystal diamond. The present review addresses this problem and appraises the results reached by now in studying the possibility of developing composites in diamond-containing systems with a view of obtaining materials with a high thermal conductivity.

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Section: Composites Fabricated By High-pressure High-temperature supporting

confidence: 60%

Thermal Conductivity of Diamond Composites

2009

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“…There are some previous publications which consider two layer heat conduction systems to determine the effective quantitative thermal conductivity. Both steady state techniques, such as the heated bar method [1], and modulation techniques, such as the real-time holographic interferometry [2], were applied in those former experiments. However, those applied techniques all have in common the disadvantage of measuring great volumes in comparison to the existent grain sizes.…”

Section: Introductionmentioning

confidence: 99%

Comparison of Thermal Conductivities on Abraded and Untreated CVD-Diamond Obtained by Scanning Thermal Microscopy

Altes

Heiderhoff

Balk

et al. 2002

Int. J. Mod. Phys. B

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Diamond materials have become progressively significant in the fabrication of heat sinks for power devices and lasers. To investigate the influence of polishing on CVD-Diamond, the surfaces of <100> and <110> coatings were analyzed, after a first abrasive treatment on a 30um diamond grit by scanning thermal microscopy based on a resistive platinum-probe. This technique describes in first order approximation the heat transfer of a metal-diamond interface. Through this method it was possible to diagnose a relevant reduction in thermal conductivity by a harsh sample preparation depending on the crystal orientation. The thermal conductivity of as deposited <100> diamond was measured at 1290 W/mK and was reduced to 520 W/mK. The thermal conductivity of as deposited <110> diamond was determined at 1780 W/mK whereas the same diamond surface, but abraded, shows a thermal conductivity of just 460 W/mK. Additionally the received images which represents the thermal conductivity qualitatively bring forward micro structures like e.g. grain boundaries.

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“…Diamond-like carbon (DLC) possesses high thermal conductivity, thermal diffusivity, and thermal radiation; furthermore, the coefficient of thermal expansion (CTE) of DLC is similar to that of GaN. DLC has very good thermal conductivity (600 W/mK) and thermal diffusivity (370 mm 2 /s), that is, 1.5 and 3.3 times higher than that of copper [5,6]. The DLC can be very effective for heat dissipation and hot spot removal.…”

Section: Introductionmentioning

confidence: 99%

Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers

Tsai

Huang

Sung³

et al. 2014

International Journal of Photoenergy

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The temperature-dependent optical, electrical, and thermal properties of flip-chip light emitting diodes (FCLEDs) with diamondlike carbon (DLC) heat-spreading layers were investigated. On the basis of the measured results in the 20 ∘ C to 100 ∘ C temperature range, a significant performance improvement can be achieved for FCLEDs with DLC heat-spreading layers (DLC-FCLED) compared with FCLEDs without DLC heat-spreading layers (non-DLC-FCLED). The external quantum efficiency (EQE) of the DLC-FCLED improves by 9% at an injection current of 1000 mA and a temperature of 100 ∘ C. The forward voltage and spectra variations are smaller than those of non-DLC-FCLEDs. The DLC-FCLED provides high efficiency and high stability performance for high-power and high-temperature applications. ExperimentalThe schematic of the LED cross section is shown in Figure 1. The GaN LED epilayers were grown by metal-organic chemical vapor depositions onto (0001) sapphire substrates. The LED structure consisted of a low-temperature 200 nm thick GaN buffer layer, a 2 m thick undoped GaN layer, a 2 m thick and highly conductive n-type GaN layer, an InGaN-GaN multiple-quantum-well (MQW) active layer, and a

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Measuring thermal conductivity of CVD diamond and diamond-like films on silicon substrates by holographic interferometry

Cited by 31 publications

References 2 publications

Thermal Conductivity of Diamond Composites

Thermal Conductivity of Diamond Composites

Comparison of Thermal Conductivities on Abraded and Untreated CVD-Diamond Obtained by Scanning Thermal Microscopy

Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers

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