1986
DOI: 10.1002/polb.1986.090241003
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Mechanical and dielectric relaxations of epoxide resins containing spiro‐ring structure

Abstract: Low‐temperature relaxation behavior was investigated for a bisphenol‐A and three spiroring type epoxide resins cured with aromatic and spiro‐ring‐type diamines. A new well‐defined relaxation denoted here as the β′ relaxation was observed from 50 to 100°C for the spiro‐ring‐type resin systems in both mechanical and dielectric measurements. The peak height and the activation energy of the β′ relaxation were entirely independent of the degree of curing. It is concluded that the β′ relaxation is due to the motion … Show more

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Cited by 52 publications
(28 citation statements)
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“…process for the CTBN could be accurately chara~t e r i z e d .~~ Using plots of tan 6{ = d'/ t' ) , it was possible in the case of DGEBA/DDM/CTBN to locate both processes and a set of values for the activation energy of this process were calculated using these data33 (Table VI) . The value obtained for the pure resin is in good agreement with 81.3 kJ/mol quoted by Mangion and Johari2* and Ochi et al 47 Changes that occur to the 0 process can best be compared from plots of the dielectric loss as a function of concentration ( Fig. 7 and 8) at -20 and -30°C.…”
supporting
confidence: 69%
“…process for the CTBN could be accurately chara~t e r i z e d .~~ Using plots of tan 6{ = d'/ t' ) , it was possible in the case of DGEBA/DDM/CTBN to locate both processes and a set of values for the activation energy of this process were calculated using these data33 (Table VI) . The value obtained for the pure resin is in good agreement with 81.3 kJ/mol quoted by Mangion and Johari2* and Ochi et al 47 Changes that occur to the 0 process can best be compared from plots of the dielectric loss as a function of concentration ( Fig. 7 and 8) at -20 and -30°C.…”
supporting
confidence: 69%
“…However, a 15°C difference in the average peak values of the lower temperature ȕ-transition was observed between the two composite types (-72 ± 3 °C and -57 ± 3 °C for the thermally and microwave cured composites respectively). The low ȕ-transition in epoxy systems has been observed between -80°C to -40°C [37][38][39]. More specific in epoxy-amine curing, lowtemperature relaxations are mainly associated with the molecular motion of the hydroxyether portion of the molecule [40].…”
Section: Resultsmentioning
confidence: 99%
“…The raw material of the epoxy resin is the dihydric phenol derivative which is the reaction product obtained from the dehydration condensation of vanillin and pentaerythriol. 143,144 Cardanol, a major component of cashew nut shell liquid, is a phenol derivative having a meta substituent of a C 15 unsaturated hydrocarbon chain with one to three double bonds. It has drawn considerable attention from many researchers for the production of phenolic resins under different sets of conditions.…”
Section: Iii1 Epichlorohydrin Synthesis Of Phenolic Epoxy Prepolymersmentioning
confidence: 99%