“…Fillers are generally added in adhesive formulations to provide some of these simultaneous benefits [3]: increase thermal and electrical conductivity, increase thermal stability, reduce coefficient of thermal expansion, reduce shrinkage and stress during cure, improve bond strength, improve flow properties, extend pot life, reduce cost [3] [5]. Substances often used as fillers include: silver flake, aluminium nitride, composite clay, zinc oxide, carbon black, hydrated alumina, calcium carbonate, fused silica, silicates and boron nitride.…”