2013
DOI: 10.1016/j.jallcom.2013.03.190
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Mechanical and thermal processing effects on crystal defects and thermoelectric transport properties of Bi2(Se,Te)3 compounds

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Cited by 16 publications
(6 citation statements)
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“…In addition to compositional control (Section ) and synthesis environment control (Section ), mechanical control via post‐synthesis deformation is another approach . It is well known that the p‐type Bi 2 Te 3 ingots can be inverted to n‐type simply by pressing, and the pressed n‐type material can be re‐inverted to p‐type via sintering at sufficiently high temperatures .…”
Section: Manipulation Of Intrinsic Point Defectsmentioning
confidence: 99%
“…In addition to compositional control (Section ) and synthesis environment control (Section ), mechanical control via post‐synthesis deformation is another approach . It is well known that the p‐type Bi 2 Te 3 ingots can be inverted to n‐type simply by pressing, and the pressed n‐type material can be re‐inverted to p‐type via sintering at sufficiently high temperatures .…”
Section: Manipulation Of Intrinsic Point Defectsmentioning
confidence: 99%
“…Bi 2 Te 3 -based materials usually contain many types of defects, such as vacancies, antisite defects, dislocations, twins, secondary phases, and voids. These defects may evolve under service conditions and further affect the TE performance of Bi 2 Te 3 -based materials. , Thus, it is important to study the thermal stabilities of Bi 2 Te 3 -based materials when subjected to various thermal treatments, such as thermal annealing, thermal shock, and thermal fatigue. These processes correspond partially to the assorted and complicated service conditions.…”
Section: Thermal Stability Of Bi2te3-based Materialsmentioning
confidence: 99%
“…14,15 Once the vacancy concentration is oversaturated, the excess V Te defects will be eliminated during thermal annealing due to their high mobility along basal planes and dislocation cores. 16 Among various Bi−Te-based compounds, (Bi,Sb) 2 Te 3 and Bi 2 (Se,Te) 3 are two representative P-type and N-type semiconductors used in commercial thermoelectric devices. For Bi 2 (Se,Te) 3 , Se addition would increase the probability of forming V Te defects because Se atoms tend to occupy Te (2) sites and evaporate readily due to their low evaporation energy of ∼37.7 kJ/mol.…”
Section: ■ Introductionmentioning
confidence: 99%
“…The basal gliding has a major impact on V Te defects, while the nonbasal one influences both V Te and V Bi with a concentration ratio of [V Te ]/[V Bi ] equal to 3/2 . The dislocation-mediated vacancy annihilation mechanism has been successfully adapted to explain the change of carrier concentration for the Bi–Te compounds subject to plastic deformation and postannealing. , Once the vacancy concentration is oversaturated, the excess V Te defects will be eliminated during thermal annealing due to their high mobility along basal planes and dislocation cores …”
Section: Introductionmentioning
confidence: 99%