Mechanical and thermal properties of AlN–BN–SiC ceramics

Buchheit, Andrew A.; Hilmas, Greg; Deason, D.; Wang, Hsin

doi:10.1016/j.msea.2008.05.051

Cited by 17 publications

(7 citation statements)

References 21 publications

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“…Bars of 9ABS‐V had an average strength of 554 ± 60 MPa. All other properties previously reported are summarized in Table I 18 . The differences in strengths of the ABS materials leads to the conclusion that there are differences in the surfaces of the samples after grinding.…”

Section: Resultsmentioning

confidence: 89%

“… Calculated R parameter values as a function of temperature for ABS‐V and ABS‐P parallel to the hot pressed direction 18 and ACβ. …”

Section: Resultsmentioning

confidence: 99%

“…The powder processing was the same as previously reported for ABS ceramics 18 . Nomenclature for materials produced refers to the matrix, ABS, followed by the type of BN, ‐P for HCP and ‐V for HCV.…”

Section: Methodsmentioning

confidence: 99%

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Thermal Shock Resistance of an AlN–BN–SiC Ceramic

Buchheit

Hilmas²,

Fahrenholtz

et al. 2009

Journal of the American Ceramic Society

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Mechanical and thermal properties of AlN-BN-SiC (ABS) ceramics were used to calculate the R, R 0 , and R 0000 thermal shock parameters. The R parameter values ranged from B4001 to 4501C. Specimens were thermal shocked by water quenching and the critical quench temperatures (DT C ) were compared with those of a baseline SiC composition. The behavior of the ABS was predicted by R parameter calculations while the behavior of the baseline material was predicted by the R 0 calculations due to its higher thermal conductivity (87 W . (m . K) -1 ) as compared with the ABS materials (B30 W . (m . K) À1 ). The highest critical quench temperature for ABS was B4151C with the lowest at 3601C, while the critical quench temperature for the baseline material was 4501C. Using temperature dependent data over an appropriate temperature range (room temperature to the predicted DT C ), the R parameters of the ABS materials were within 151C of predictions. The baseline material was B1.7 times higher than predicted and this was attributed to the highthermal conductivity of the material resulting in soft thermal shock during quench testing.

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Section: Resultsmentioning

confidence: 89%

“… Calculated R parameter values as a function of temperature for ABS‐V and ABS‐P parallel to the hot pressed direction 18 and ACβ. …”

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

Thermal Shock Resistance of an AlN–BN–SiC Ceramic

Buchheit

Hilmas²,

Fahrenholtz

et al. 2009

Journal of the American Ceramic Society

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“…On the other hand, most of studies have focus on the thermal conductivity of AlN ceramics [5]. To expand the application of AlN ceramics, it is necessary to investigate other properties, such as dielectric properties.…”

Section: Introductionmentioning

confidence: 99%

Study on microstructure and dielectric properties of aluminum nitride ceramics

Shi

Guo

et al. 2015

Materials Characterization

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“…Dense 2H AlN-SiC solid solution was obtained by the post-heat treatment of dense AlN-SiC composites prepared by spark plasma sintering [14], where AlN-SiC samples with different phases were obtained. Because of the importance of AlN-SiC system, properties (mechanical, thermal, and oxidation behavior) of ternary composites (AlN-SiC-TiB 2 [15], ZrB 2 -SiC-AlN [16] and AlN-BN-SiC [17]) prepared by different methods have been examined.…”

Section: Introductionmentioning

confidence: 99%