“…Moreover, since MEMS technology integrates microdevices or systems combining electrical and mechanical components, the failure modes and mechanisms must be interpreted before they can be traced back to the most known failure mechanisms in the traditional field of electronics or mechanics. Several mechanical failure mechanisms in MEMS and experimental testing procedures have been presented in the literature, considering different applications and microfabrication processes, such as buckling [4], fatigue [5,6], thermal effect and creep [7][8][9][10], wear and tribology [11]. The mechanical reliability of MEMS devices is strongly influenced by the microfabrication process and mechanical properties of the structural material including Young's Modulus, yield strength, fracture strength, creep, residual stress, and stress-strain relationship under different loading conditions.…”