“…Thus, the inability to accurately design the curing process may lead to a poor fibre/matrix bonding, large residual stress, and can even lead to thermal degradation of the matrix due to high temperature [57]. [58] Biobased Epoxy resin Pouladvand et al, [59] DGEBA Epoxy and EPON828 Epoxy resin H. Li et al, [60] Epoxy Resin Gbadeyan et al, [61] LR 30 and LH 30 Epoxy resin Memon et al, [62] AFG-90H Epoxy resin Walte et al, [63] HSC 7660 Epoxy resin Shi et al, [64] Epoxy Resin Raju et al, [65] LY556 Epoxy resin C. Zheng et al, [66] Phenolic Resin S. Yang et al, [67] DGEBA Epoxy resin S. Y. Kim et al, [68] EPON828 Epoxy resin Austermann et al, [69] Epoxy-based photopolymer resin EPX81 K. Zhang et al, [70] DGEBA E51 Epoxy resin Shukla et al, [71] LY556 Epoxy resins Jenkins et al, [72] IN2 Epoxy Ekrem et al, [73] DGEBA Epoxy resin Zhao et al, [74] DGEBA Epoxy resin Lei et al, [75] Modified resol phenolic resin Billisik and Sapanci [76] Araldite EPN 1138 Phenolic Resin Ciesielski et al, [77] DGEBA Epoxy resin Asaro et al, [78] Ammonium-modified phenolic resin Martins et al, [79] DGEBA Epoxy resin M. Li et al, [80] Epoxy resin E51…”