Mechanical Characterization of Intermetallic Compounds in SAC Solder Joints at Elevated Temperatures

Fahim, Abdullah; Ahmed, Sudan; Suhling, Jeffrey C.; Lall, Pradeep

doi:10.1109/itherm.2018.8419525

Cited by 24 publications

(7 citation statements)

References 41 publications

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“…However, the E/H values for Cu 6 Sn 5 does not increase with previously studied third elements (such as Ni and Zn). For instance, E/H values for (Cu,Ni) 6 Sn 5 with various amount of Ni is slightly below Cu 6 Sn 5 [31,89,98,99]. Zn does not change the E/H value of Cu 6 Sn 5 [97].…”

Section: Nano-indentation Testmentioning

confidence: 84%

Microstructural and Mechanical Characterization of Cu/Sn Slid Bonding Utilizing Co as Contact Metallization Layer

Emadi¹,

Vuorinen²,

Mertin³

et al. 2022

SSRN Journal

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Section: Nano-indentation Testmentioning

confidence: 84%

Microstructural and Mechanical Characterization of Cu/Sn Slid Bonding Utilizing Co as Contact Metallization Layer

Emadi¹,

Vuorinen²,

Mertin³

et al. 2022

SSRN Journal

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“…With increasing temperature, the size of the indenter slightly increases from approximately 4.04 µm at 30 °C Based on these observations, a pure and densified ζ (Ag 3 In) phase bulk sample was successfully fabricated, providing the foundation for further thermomechanical measurements. [31], Cu3Sn [32], Ni3Sn4 [33], Ag3Sn [34], Ag9In4 [26], and ζ (Ag3In) phase at elevated temperatures.…”

Section: Characterization Of Bulk ζ (Ag 3 In) Samplesmentioning

confidence: 99%

Thermomechanical Properties of Zeta (Ag3In) Phase

Liu,

Tatsumi,

Jin

et al. 2023

Materials

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The thermomechanical properties of materials within die-attach joints play an essential role in assessing the reliability of high-power modules. Ag-In transient liquid phase (TLP) bonding serves as an alternative method for die attachment. However, relevant material data for the ζ (Ag3In) phase, one of the Ag-In intermetallic compound (IMC) products of TLP bonding, are limited. This paper proposes an approach to fabricate a densified and pure bulk sample of the ζ (Ag3In) phase. The thermomechanical properties of the ζ (Ag3In) phase were subsequently investigated at elevated temperatures and compared to those of other IMCs frequently observed in die-attach joints. As the temperature increased from 30 °C to 200 °C, the hardness of the ζ (Ag3In) phase decreased linearly from 1.78 GPa to 1.46 GPa. Similarly, the Young’s modulus also decreased linearly from 82.3 GPa to 66.5 GPa. These properties rank among the lowest levels compared to those of other IMCs. The average coefficient of thermal expansion within the temperature range of 70 °C to 250 °C was approximately 18.63 ± 0.61 μm/m/°C, placing the ζ (Ag3In) phase at a moderate level. When considering its potential for mitigating thermal stress, these combined properties render the ζ (Ag3In) phase an appropriate material choice for die-attach joints compared to other IMCs.

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“…From the foregoing, it is crucial to seek a reliable surface finish for the Cu substrate applications. Numerous investigations were done on the interfacial reaction between surface finish and lead-free solder (Milad, 2008; Yoon and Jung, 2008; Wang et al , 2009; Akhtar et al , 2015; Saliza Azlina et al , 2011; Sona and Prabhu, 2014; Fahim et al , 2018). Notably, interest was on the interfacial reaction between lead-free solder and electroless nickel/immersion gold (ENIG).…”

Section: Introductionmentioning

confidence: 99%

The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces

Anuar

Osman

2020

SSMT

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Purpose The surface finish is an essential step in printed circuit boards design because it provides a solderable surface for electronic components. The purpose of this study to investigate the effects of different surface finishes during the soldering and ageing process. Design/methodology/approach The solder joints of Sn-4.0Ag-0.5Cu/Cu and Sn-4.0Ag-0.5Cu/electroless nickel/immersion silver (ENImAg) were investigated in terms of intermetallic (IMC) thickness, morphology and shear strength. The microstructure and compositions of solder joints are observed, and analyzed by using scanning electron microscopy (SEM-EDX) and optical microscope (OM). Findings Compounds of Cu6Sn5 and (Cu, Ni)6Sn5 IMC were formed in SAC405/Cu and SAC405/ENImAg, respectively, as-reflowed. When the sample was exposed to ageing, new layers of Cu3Sn and (Ni, Cu)3Sn5 were observed at the interface. Analogous growth in the thickness of the IMC layer and increased grains size commensurate with ageing time. The results equally revealed an increase in shear strength of SAC405/ENImAg because of the thin layer of IMC and surface finish used compared to SAC405/Cu. Hence, a ductile fracture was observed at the bulk solder. Overall, the ENImAg surface finish showed excellent performance of solder joints than that of bare Cu. Originality/value The novel surface finish (ENImAg) has been developed and optimized. This alternative lead-free surface finish solved the challenges in electroless nickel/immersion gold and reduced cost without affecting the performance.

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Mechanical Characterization of Intermetallic Compounds in SAC Solder Joints at Elevated Temperatures

Cited by 24 publications

References 41 publications

Microstructural and Mechanical Characterization of Cu/Sn Slid Bonding Utilizing Co as Contact Metallization Layer

Microstructural and Mechanical Characterization of Cu/Sn Slid Bonding Utilizing Co as Contact Metallization Layer

Thermomechanical Properties of Zeta (Ag3In) Phase

The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces

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