2017 IEEE 67th Electronic Components and Technology Conference (ECTC) 2017
DOI: 10.1109/ectc.2017.336
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Mechanical Characterization of SAC Solder Joints at High Temperature Using Nanoindentation

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Cited by 34 publications
(4 citation statements)
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“…The creep of the reference Sn-Zn material and material doped with Ag nanoparticles was studied by nanoindentation. For the creep evaluation of Sn-based materials, a similar indentation load (10,000 µN) was applied in the earlier literature [25]. From the load versus penetration depth and creep displacement at maximum load, as presented in Figure 2c,d, the penetration depth of the reference material was higher than that of the Sn-Zn material doped with Ag nanoparticles.…”
Section: Temperature Dependence Of the Elastic Properties Of Sn-zn-bamentioning
confidence: 95%
“…The creep of the reference Sn-Zn material and material doped with Ag nanoparticles was studied by nanoindentation. For the creep evaluation of Sn-based materials, a similar indentation load (10,000 µN) was applied in the earlier literature [25]. From the load versus penetration depth and creep displacement at maximum load, as presented in Figure 2c,d, the penetration depth of the reference material was higher than that of the Sn-Zn material doped with Ag nanoparticles.…”
Section: Temperature Dependence Of the Elastic Properties Of Sn-zn-bamentioning
confidence: 95%
“…Thermal drift is a well-known phenomenon also during quasistatic nanoindentation. [38,39] Therefore, many devices provide built-in options for drift correction. These are usually based on monitoring the displacement for a certain period of time before the actual test while maintaining a constant, very low load.…”
Section: Introductionmentioning
confidence: 99%
“…[39,41] A different approach is to use so-called reference segments at the beginning of the test during which initial values are determined, e.g., for the indent displacement in creep tests or for contact modulus in dynamic measurements. [32,38,42] Based on these values, which are presumably unaffected by significant thermal drift, the indent or contact area is continuously calculated throughout the measurement. [32,38] Thus, the influence of thermal drift on the results is reduced because they are independent of the actual measurement of the indentation depth during the experiment.…”
Section: Introductionmentioning
confidence: 99%
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