2004
DOI: 10.1063/1.1821638
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Mechanical dissipation in tetrahedral amorphous carbon

Abstract: We have fabricated micromechanical oscillators from tetrahedrally coordinated amorphous carbon (ta-C) in order to study mechanical dissipation mechanisms in this material. Cantilever oscillators with either in-plane or out-of-plane dominant transverse vibrational modes and free-free beam oscillators with in-plane modes were fabricated with critical dimensions ranging from 75nm to over 1mm. The resonant frequency and quality factor were measured for all oscillators. The resonant frequencies ranged from a few ki… Show more

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Cited by 32 publications
(8 citation statements)
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“…9,10 In this technique, a substrate containing micrometer sized cantilever beams is attached to a piezoelectric actuator and a laser beam is reflected over its surface. The reflected laser signal is directed into a photodetector, which converts the oscillating light signal into a voltage signal.…”
Section: Young's Modulus Of Vo 2 Thin Films As a Function Of Temperatmentioning
confidence: 99%
“…9,10 In this technique, a substrate containing micrometer sized cantilever beams is attached to a piezoelectric actuator and a laser beam is reflected over its surface. The reflected laser signal is directed into a photodetector, which converts the oscillating light signal into a voltage signal.…”
Section: Young's Modulus Of Vo 2 Thin Films As a Function Of Temperatmentioning
confidence: 99%
“…These include internal friction mechanisms such as thermoelastic damping ͑TED͒ which is associated with thermal losses generated by the stretching and compression of the material during oscillation. The quality factor of a resonator limited by TED is given by 35,36 …”
Section: Introductionmentioning
confidence: 99%
“…In electromechanical resonators, energy dissipation can occur through a wide variety of mechanisms. 9 Among these mechanisms are intrinsic processes such as thermoelastic dissipation (TED), 10 dissipation due to electron-phonon interactions, 11 and dissipation due to phonon-phonon interactions. 12 These mechanisms are inherent in any material and thus are omnipresent in any functional device.…”
Section: Introductionmentioning
confidence: 99%