Mechanical enhancement and dielectric properties of SiO2 contained polyimides under high frequency

Li, Heming; Wang, Xinming; Wu, Tao; Gong, Yuze; Zhao, Hongbin; Liu, Zhaobin; Dastan, Davoud; Ma, Ke; Hu, Zhizhi

doi:10.1007/s10854-023-11731-w

Cited by 4 publications

(2 citation statements)

References 46 publications

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“…The characteristic absorption bands at 1720 cm −1 and 1780 cm −1 can be observed in all curves, which indicate the C=O symmetric and asymmetric vibrations of imide rings. The absorption band at 720 cm −1 was caused by the vibration of the imine ring skeleton [ 42 , 43 , 44 ]. The peak at 1058 cm −1 was caused by Si-O-Si skeleton vibration of the PDMS.…”

Section: Resultsmentioning

confidence: 99%

Adhesion and Transparency Enhancement between Flexible Polyimide-PDMS Copolymerized Film and Copper Foil for LED Transparent Screen

Wang,

Zhao,

et al. 2024

Polymers

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With the increasing demand for innovative electronic products, LED transparent screens are gradually entering the public eye. Polyimide (PI) materials combine high temperature resistance and high transparency, which can be used to prepare flexible copper-clad laminate substrates. The physical and chemical properties of PI materials differ from copper, such as their thermal expansion coefficients (CTEs), surface energy, etc. These differences affect the formation and stability of the interface between copper and PI films, resulting in a short life for LED transparent screens. To enhance PI-copper interfacial adhesion, aminopropyl-terminated polydimethylsiloxane (PDMS) can be used to increase the adhesive ability. Two diamine monomers with a trifluoromethyl structure and a sulfone group structure were selected in this research. Bisphenol type A diether dianhydride is a dianhydride monomer. All three of the above monomers have non−coplanar structures and flexible structural units. The adhesion and optical properties can be improved between the interface of the synthesized PI films and copper foil. PI films containing PDMS 0, 1, 3, and 5 wt% were analyzed using UV spectroscopy. The transmittance of the PI-1/3%, PI-1/5%, PI-2/3%, and PI-2/5% films were all more than 80% at 450 nm. Meanwhile, the Td 5% and Td 10% heat loss and Tg temperatures decreased gradually with the increase in PDMS. The peel adhesion of PI-copper foil was measured using a 180° peel assay. The effect of PDMS addition on peel adhesion was analyzed. PIs-3% films had the greatest peeling intensities of 0.98 N/mm and 0.85 N/mm.

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Section: Resultsmentioning

confidence: 99%

Adhesion and Transparency Enhancement between Flexible Polyimide-PDMS Copolymerized Film and Copper Foil for LED Transparent Screen

Wang,

Zhao,

et al. 2024

Polymers

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“…The molar ratio of DPT/dianhydride/CED is 1:1:0.1-0.4. The PI/CED host guest inclusion films were prepared according to the conventional two-step thermal method, as mentioned in our past work [38,39]. 2 [35][36][37].…”

Section: Preparation Of Crown Ether Diamine (Ced)mentioning

confidence: 99%

Crown Ether Copolymerized Polyimide Film: Enhanced Mechanical, Thermal Properties and Low Dielectric Constant under High Frequency

Li,

Wang,

Ding

et al. 2024

Polymers

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Polymer materials with a low dielectric constant and low dielectric loss have the potential to be applied to high-frequency signal transmissions, such as mobile phone antennas and millimeter wave radars. Two types of diamines, 4,4′-diamino-p-tetraphenyl (DPT) and crown ether diamine (CED), were prepared for ternary copolymerization with BPDA in this study. Cross-links with molecular chains were formed, increasing molecular chain distance by utilizing rings of CED. The MPI films exhibit a good thermal performance with the increase in CED addition, with Tg > 380 °C and CTE from −4 × 10−6 K−1 to 5 × 10−6 K−1. The Young’s modulus can reach 8.6 GPa, and the tensile strength is above 200 MPa when 5% and 7% CED are introduced. These MPI films exhibit good mechanical performances. The dielectric constant of PI−10% film can go as low as 3.17. Meanwhile, the relationship between dielectric properties and molecular structure has been demonstrated by Molecular Simulation (MS). PI molecules are separated by low dielectric groups, resulting in a decrease in the dielectric constant.

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Cyanate Ester/TiO₂ Composites for High‐Temperature and Miniaturized Microwave Substrate Applications

Hunize,

Azeem,

Joseph

et al. 2024

Physica Status Solidi (a)

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High‐temperature‐withstanding TiO2‐reinforced cyanate ester composites are developed by mechanical stirring, followed by curing at elevated temperatures. The uniform dispersion of the filler is confirmed using scanning electron microscopy and electron dispersive spectroscopy. All composites, up to a filler fraction of 30 vol%, exhibit a density of more than 90% while it reduces significantly after that. A high relative permittivity of 7.6 and a low loss tangent of 0.0112 are observed for the optimally filled 30 vol%. The addition of the filler further improves the temperature‐withstanding capability of the cyanate ester matrix. Moreover, a high thermal conductivity of 0.543 W mK−1, improved hardness of 24.88 HV, ultimate tensile strength of 11.68 MPa, and a low coefficient of thermal expansion of 36.44 ppm °C−1 are also shown by the optimally filled sample. A moisture absorption of 0.072 vol% observed for the optimal filled sample comes within the limit for microwave substrate applications. Thus, the developed composites are suitable candidates for high‐temperature microwave electronic applications.

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Mechanical enhancement and dielectric properties of SiO2 contained polyimides under high frequency

Cited by 4 publications

References 46 publications

Adhesion and Transparency Enhancement between Flexible Polyimide-PDMS Copolymerized Film and Copper Foil for LED Transparent Screen

Adhesion and Transparency Enhancement between Flexible Polyimide-PDMS Copolymerized Film and Copper Foil for LED Transparent Screen

Crown Ether Copolymerized Polyimide Film: Enhanced Mechanical, Thermal Properties and Low Dielectric Constant under High Frequency

Cyanate Ester/TiO₂ Composites for High‐Temperature and Miniaturized Microwave Substrate Applications

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Mechanical enhancement and dielectric properties of SiO2 contained polyimides under high frequency

Cited by 4 publications

References 46 publications

Adhesion and Transparency Enhancement between Flexible Polyimide-PDMS Copolymerized Film and Copper Foil for LED Transparent Screen

Adhesion and Transparency Enhancement between Flexible Polyimide-PDMS Copolymerized Film and Copper Foil for LED Transparent Screen

Crown Ether Copolymerized Polyimide Film: Enhanced Mechanical, Thermal Properties and Low Dielectric Constant under High Frequency

Cyanate Ester/TiO2 Composites for High‐Temperature and Miniaturized Microwave Substrate Applications

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Product

Resources

About

Cyanate Ester/TiO₂ Composites for High‐Temperature and Miniaturized Microwave Substrate Applications