Mechanical modeling and analysis of direct wafer bonding technology considering the effect of impurity particles

Tang, Feixiang; He, Siyu; Liu, Xiuming; Dong, Fang; Liu, Sheng

doi:10.1016/j.compstruct.2024.118462

Composite Structures

2024

DOI: 10.1016/j.compstruct.2024.118462

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Mechanical modeling and analysis of direct wafer bonding technology considering the effect of impurity particles

Feixiang Tang,

Siyu He,

Xiuming Liu

et al.

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Mechanical modeling and analysis of direct wafer bonding technology considering the effect of impurity particles

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References 22 publications

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