Mechanical Properties and Deformation of LiTaO&lt;sub&gt;3&lt;/sub&gt; Single Crystals Characterised by Nanoindentation and Nanoscratch

He, An; Huang, Han; Zhou, Li

doi:10.4028/www.scientific.net/amr.565.564

Cited by 4 publications

(4 citation statements)

References 15 publications

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“…The Y-42° plane was the weakest orientation in a single crystal of LiTaO 3 . It is worth mentioning that the H and E in LiTaO 3 were comparable with He et al’s result using the Berkovich indenter [15] and higher than Anasori et al’s result using spherical tips [16].…”

Section: Resultssupporting

confidence: 76%

Room-Temperature Creep Behavior and Activation Volume of Dislocation Nucleation in a LiTaO3 Single Crystal by Nanoindentation

Huang

Song

et al. 2019

Materials

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The crystal orientation effect on mechanical heterogeneity of LiTaO3 single crystals is well known, whilst the time-dependent plastic behavior, i.e., creep is still short of understanding. Relying on nanoindentation technology, we systematically studied room-temperature creep flows at various holding depths (100 nm to 1100 nm) in three typical orientations namely the X-112°, Y-36° and Y-42° planes. Creep resistance was much stronger in the X-112° plane than the others. In the meanwhile, creep features were similar in the Y-36° and Y-42° planes. The orientation effect on creep deformation was consistent with that on hardness. The nanoindentation length scale played an important role in creep deformation that creep strains were gradually decreased with the holding depth in all the planes. Based on strain rate sensitivity and yield stress, the activation volumes of dislocation nucleation were computed at various nanoindentation depths. The activation volumes ranged from 5 Å3 to 23 Å3 for the Y-36° and Y-42° planes, indicating that a point-like defect could be the source of plastic initiation. In the X-112° plane, the activation volume was between 6 Å3 and 83 Å3. Cooperative migration of several atoms could also be the mechanism of dislocation activation at deep nanoindentation.

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Section: Resultssupporting

confidence: 76%

Room-Temperature Creep Behavior and Activation Volume of Dislocation Nucleation in a LiTaO3 Single Crystal by Nanoindentation

Huang

Song

et al. 2019

Materials

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“…In the scratch test regarding normal force, we observed the surface of LiTaO3 at millimeter scale and measured the friction force. In contrast to the study conducted by et al [4], which focused on the micrometer scale, we were unable to determine the ex initiation point of microcrack formation on a microscopic scale. However, it was de mined that a normal force of 6.0 N is necessary for the fracture of the LiTaO3 wafer, in cating the threshold for effectively preventing edge chipping.…”

Section: Boundary Condition Valuecontrasting

confidence: 69%

“…Lithium tantalate (LiTaO 3 ) is a typical multifunctional single-crystal material with electro-optical, acoustic, piezoelectric, pyroelectric, and nonlinear optical properties [1][2][3]. These properties make LiTaO 3 an important functional material for surface acoustic wave (SAW) devices, and thinner processing with a lower surface roughness of LiTaO 3 is increasingly required for downsizing and obtaining high-performance products [4][5][6]. To secure thin thicknesses and high-quality surfaces of LiTaO 3 , grinding and chemical mechanical polishing (CMP), a process of planarization using a combination of chemical and mechanical forces, are used.…”

Section: Introductionmentioning

confidence: 99%

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An Analysis of Edge Chipping in LiTaO3 Wafer Grinding Using a Scratch Test and FEA Simulation

2023

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Lithium tantalite (LiTaO3) is a representative multifunctional single-crystal material with electro-optical, acoustic, piezoelectric, pyroelectric, and nonlinear optical properties used as a substrate for surface acoustic wave (SAW) devices. To enhance SAW device performance, thinner LiTaO3 substrates with improved surface roughness are desired. Chemical mechanical polishing (CMP) is employed to achieve the desired surface roughness after grinding. However, the thinning process increases the risk of substrate fracture, especially at the edges, resulting in edge chipping. Edge chipping can lead to complete substrate failure during SAW device fabrication, requiring an effective wafer geometry to prevent it. The study utilizes scratch tests and finite element analysis (FEA) to identify the optimal edge shape (C-cut, trimmed, and thinned) for preventing edge chipping on LiTaO3 wafers. The C-cut edge refers to the rounding of the wafer’s edge, while the trimmed edge refers to the machining of the wafer’s edge to be perpendicular to the wafer surface. As a result of the scratch tests, we observed edge-chipping lengths of 115 and 227 μm on the C-cut and trimmed edges, respectively, while the thinned edge (half C-cut) resulted in complete wafer fracture. In the finite element analysis (FEA), edge-chipping lengths of 80, 120, and 150 μm were obtained on the C-cut, trimmed, and thinned edges (half C-cut), respectively. In conclusion, it has been confirmed that the C-cut, trimmed, and thinned edge shapes are effective in preventing edge chipping. However, considering that the C-cut edge shape becomes thinner through grinding, using the trimmed edge shape appears to be the most effective.

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Nd:MgO:LiTaO3 crystal for self-doubling laser applications: growth, structure, thermal and laser properties

Leng

Sang

et al. 2013

CrystEngComm

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Mechanical Properties and Deformation of LiTaO<sub>3</sub> Single Crystals Characterised by Nanoindentation and Nanoscratch

Cited by 4 publications

References 15 publications

Room-Temperature Creep Behavior and Activation Volume of Dislocation Nucleation in a LiTaO3 Single Crystal by Nanoindentation

Room-Temperature Creep Behavior and Activation Volume of Dislocation Nucleation in a LiTaO3 Single Crystal by Nanoindentation

An Analysis of Edge Chipping in LiTaO3 Wafer Grinding Using a Scratch Test and FEA Simulation

Nd:MgO:LiTaO3 crystal for self-doubling laser applications: growth, structure, thermal and laser properties

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