2012
DOI: 10.1016/j.jmbbm.2012.01.018
|View full text |Cite
|
Sign up to set email alerts
|

Mechanical properties and degree of conversion of etch-and-rinse and self-etch adhesive systems cured by a quartz tungsten halogen lamp and a light-emitting diode

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
5

Citation Types

7
29
0
5

Year Published

2013
2013
2022
2022

Publication Types

Select...
9

Relationship

1
8

Authors

Journals

citations
Cited by 52 publications
(41 citation statements)
references
References 21 publications
7
29
0
5
Order By: Relevance
“…Along with the elution of the antibacterial agent, the release of unreacted monomers due to a lower degree of conversion could negatively affect adhesive properties and stimulate polymer degradation (23). In this study, all groups achieved more than 50% degree of conversion, corroborating previous studies (24). The adhesive resins with 2.5% wt and 5% wt of triazine addition showed a higher initial Knoop hardness.…”
Section: Discussionsupporting
confidence: 86%
“…Along with the elution of the antibacterial agent, the release of unreacted monomers due to a lower degree of conversion could negatively affect adhesive properties and stimulate polymer degradation (23). In this study, all groups achieved more than 50% degree of conversion, corroborating previous studies (24). The adhesive resins with 2.5% wt and 5% wt of triazine addition showed a higher initial Knoop hardness.…”
Section: Discussionsupporting
confidence: 86%
“…LS adhesive resin is a self-etch adhesive system that presents a hydrophilic photo-polymerized primer. This characteristic can possibly explain the obtained results since the interlocking with the grounded surface was achieved mainly by an agent with significantly reduced mechanical properties compared to the hydrophobic agent of the same system [19]. Similar results were observed in a previous study using only the primer of LS compared to repairs using only the adhesive resin of this system [10].…”
Section: Discussionsupporting
confidence: 87%
“…Although, there have been several controversies regarding the effect of light attenuation on bond strength [32,39], many studies have shown that the improvement in mechanical behaviour [51], decrease in water sorption and solubility [52] and reduction in the bonding interfaces permeability [20,53] were directly linked to the higher DC% of the different adhesive resinss. Nevertheless, further studies should be conducted to evaluate the effect of increasing light source distance or the chemical polymerization mode of the dual-poylmerized self-etch adhesives on the bond strength of both chemical-and dual-polymerized resin composites.…”
Section: Discussionmentioning
confidence: 99%