Numerous technological applications such as electronics, optics, transportation and other industries, require the synthesis of small parts that can be covered by a film at a given moment of their construction, thus improving the characteristics of these parts for specific applications. In this sense, films are used to optimize one or more properties of the substrate on which it is deposited, or even to provide it with new physical or chemical properties. The delamination of films from their substrate is generally an undesirable phenomenon in different types of applications, for example, a large number of failures in integrated circuits result, in large part, from the mechanical behavior of the film-substrate (delamination, fractures, etc.). However, the mechanical properties of the films are tested by different conventional methods which may not be suitable for films with a thickness of less than 1 µm. As an example, among the different experimental techniques developed to study the mechanical properties of films, as well as to study the fracture characteristics of the film-substrate interface, nanoindentation tests are great for such studies, although these techniques are limited as they cannot exceed 10 − 30% of the film thickness. This work proposes, As an alternative to such limitations, new approaches that use the film's own structural deformations due to delamination to develop techniques that allow characterizing the mechanical properties of the material from which this film is made, as well as the film-substrate interface, which could be very useful in different technological applications related to microelectronics, microfluidics and, in general, NEMS and MEMS devices (Nano and Micro-Electro-Mechanical-Systems). This work initially presents analyzes performed on Straight Sides (SS) deformations. For that, deposition experiments were carried out on lithographed Poly(methyl methacrylate) (PMMA), creating areas whose lengths are much greater than their width, showing necessary experimental conditions to obtain well-formed SS-type structures which were studied through different models. Soon, theoretical models for more complex structures called Telephone Cord (TC) are presented, thus, with the study of experimental data through these models, mechanical properties of DLC films were obtained, as done for SS structures.