Mechanical Properties of Copper Films

Abstract

Mechanical properties of vacuum-deposited copper films have been studied on various well cleaned and polished substrates. The density reaches the bulk value for a film thickness of 4 pm and above. The strain developed during the growth of film was found to be tensile and is dependent on nature of the substrate. The adhesion of film was observed to be thicknessand time of ageing dependent. The results are discussed.