A three-dimensionally interconnected graphene-reinforced Cu (3Di Gr-Cu) composite was synthesized using a simple two-step process technique which involves the mechanical compaction of micronsized Cu particles followed by chemical vapor deposition (CVD) at 995 ℃. The microstructural properties of pure Cu and the 3Di Gr-Cu composite were investigated by optical microscope, scanning electron microscope, and X-ray diffractometer. The electrical and corrosion behaviors of the 3Di Gr-Cu composite and Cu only, prepared by powder metallurgy (PM Cu), were studied and compared. The electrical conductivity (EC) of the 3Di Gr-Cu composites was found to be 38.8 MSm<sup>−1</sup> at a carbon content of 73 ppm, and exhibited a 12% higher EC than the PM Cu. Due to the interconnected graphene around the Cu grains, the corrosion current density and corrosion rate of the 3Di Gr-Cu composite decreased by 29% and 40%, respectively, compared to the PM Cu. The EC of the 3Di Gr-Cu composite depended on the carbon content. The improvement in the EC of the 3Di Gr-Cu composite is attributed to the electron-carrying ability of the three-dimensionally interconnected graphene network (3DIGN) formed at the grain boundaries in the composite. The enhancement in corrosion resistance is due to the impermeability of graphene to various chemical species.