Mechanical Properties of MEMS Materials

Sharpe, W. N.

doi:10.1201/9781420050905.ch3

Cited by 53 publications

(38 citation statements)

References 8 publications

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“…The appropriate elastic modulus values for silicon for the most common load cases in MEMS are summarized in Table VI. For polysilicon structures, the "average" values of E = 160 GPa, ν = 0.22, and G = 65 GPa [18], [45] are appropriate, although it should be noted that the actual material properties of polysilicon depend strongly on the deposition conditions.…”

Section: Discussionmentioning

confidence: 99%

“…In [18], Sharpe tabulates a large number of measurements of the Young's modulus of silicon for MEMS applications. As expected, the results converge on the values calculated from acoustic wave propagation in bulk samples.…”

Section: Elastic Constantsmentioning

confidence: 99%

“…The actual elastic value of such films will vary widely between fabrication facilities and with different deposition conditions (see, e.g., [33]). Sharpe tabulates a large number of experimental measurements of polysilicon films in [18] and concludes that, for polysilicon designs, the values of E poly = 160 GPa and ν poly = 0.22 are appropriate.…”

Section: E Stress Concentrations or Multidirectional Polycrystallinementioning

confidence: 99%

See 2 more Smart Citations

What is the Young's Modulus of Silicon?

Hopcroft

Nix

Kenny

2010

J. Microelectromech. Syst.

1,759

781

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Abstract-The Young's modulus (E) of a material is a key parameter for mechanical engineering design. Silicon, the most common single material used in microelectromechanical systems (MEMS), is an anisotropic crystalline material whose material properties depend on orientation relative to the crystal lattice. This fact means that the correct value of E for analyzing two different designs in silicon may differ by up to 45%. However, perhaps, because of the perceived complexity of the subject, many researchers oversimplify silicon elastic behavior and use inaccurate values for design and analysis. This paper presents the best known elasticity data for silicon, both in depth and in a summary form, so that it may be readily accessible to MEMS designers.[

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Section: Discussionmentioning

confidence: 99%

Section: Elastic Constantsmentioning

confidence: 99%

Section: E Stress Concentrations or Multidirectional Polycrystallinementioning

confidence: 99%

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What is the Young's Modulus of Silicon?

Hopcroft

Nix

Kenny

2010

J. Microelectromech. Syst.

1,759

781

View full text Add to dashboard Cite

show abstract

“…However, much larger deformations can be achieved by the same instantaneous driving forces at the structure's mechanical resonances, where displacement will be enhanced by the quality factor of the mechanical resonator. Assuming a Young's modulus of 150 GPa for the silicon membrane, 27 the first mechanical eigenmode of the 300 nm metamolecule cantilevers-the out-of-plane oscillation of the arms-is expected from numerical simulations to occur at a frequency of 165 MHz.…”

Section: Nano-optomechanical Nonlinear Dielectric Metamaterialsmentioning

confidence: 99%

Nano-optomechanical nonlinear dielectric metamaterials

Karvounis

et al. 2015

Applied Physics Letters

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“…Also, because silicon is a brittle material, it will break rather than yield [11]. The material properties (CTE, etc.)…”

Section: Artifact Designmentioning

confidence: 99%

Silicon Bulk Micromachined Hybrid Dimensional Artifact

et al. 2010

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A mesoscale dimensional artifact based on silicon bulk micromachining fabrication has been developed and manufactured with the intention of evaluating the artifact both on a high precision coordinate measuring machine (CMM) and video-probe based measuring systems. This hybrid artifact has features that can be located by both a touch probe and a video probe system with a k=2 uncertainty of 0.4 m, more than twice as good as a glass reference artifact. We also present evidence that this uncertainty could be lowered to as little as 50 nm (k=2).While video-probe based systems are commonly used to inspect mesoscale mechanical components, a video-probe system's certified accuracy is generally much worse than its repeatability. To solve this problem, an artifact has been developed which can be calibrated using a commercially available high-accuracy tactile system and then be used to calibrate typical production vision-based measurement systems. This allows for error mapping to a higher degree of accuracy than is possible with a glass reference artifact.Details of the designed features and manufacturing process of the hybrid dimensional artifact are given and a comparison of the designed features to the measured features of the manufactured artifact is presented and discussed. Measurement results from vision and touch probe systems are compared and evaluated to determine the capability of the manufactured artifact to serve as a calibration tool for video-probe systems. An uncertainty analysis for calibration of the artifact using a CMM is presented. 3 ACKNOWLEDGMENTS

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Mechanical Properties of MEMS Materials

Cited by 53 publications

References 8 publications

What is the Young's Modulus of Silicon?

What is the Young's Modulus of Silicon?

Nano-optomechanical nonlinear dielectric metamaterials

Silicon Bulk Micromachined Hybrid Dimensional Artifact

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