Mechanical Properties of Nanoclay Reinforced Epoxy Adhesive Bonded Joints Made with Composite Materials

Khalili, S.M.R.; Tavakolian, Majid; Sarabi, Ali Asghar

doi:10.1163/016942410x507650

Cited by 50 publications

(14 citation statements)

References 9 publications

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“…In this case, the glass substrates were assembled in a straight manner, while all the other conditions were the same. The adhesive and lap shear strengths were measured with a universal testing machine (UTM; LLOYD, LR-5K, Bognor Regis, England) at room temperature according to the ASTM C663 and D3165 standards; the crosshead speed used was 1.3 mm min −1 [ 22 , 23 , 24 ].…”

Section: Methodsmentioning

confidence: 99%

Using Dihydrazides as Thermal Latent Curing Agents in Epoxy-Based Sealing Materials for Liquid Crystal Displays

Lee

2020

Polymers

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In this study, highly adhesive epoxy-based sealing materials for liquid crystal (LC) displays were fabricated using different types of dihydrazides as thermal latent curing agents. Their curing characteristics, mechanical properties, LC contamination levels, and electro-optical characteristics were investigated depending on the chemical structure of dihydrazides. The epoxy-based sealing material containing a dihydrazide derivative with a bulky heterocyclic ring afforded a high heat curing conversion of 90.4%, high adhesion strength of 54.3 kgf cm−2, and a high elongation of 57.3% due to the relatively low melting characteristic under heat treatment compared to those involving dihydrazides with short aliphatic or aromatic spacers. In addition, the proposed sealing material exhibited an extremely low LC contamination level of 9 µm, which is essential to the successful operation of LC displays. With respect to electro-optical properties of the LC device, it was found that a dihydrazide derivative with a bulky heterocyclic ring afforded a normal voltage-dependent transmittance curve and fast response time due to the prevention of abnormal homogeneous LC alignment. This study developed highly adhesive and robust epoxy-based sealing materials based on the use of dihydrazides as thermal latent curing agents for advanced LC displays.

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Section: Methodsmentioning

confidence: 99%

Using Dihydrazides as Thermal Latent Curing Agents in Epoxy-Based Sealing Materials for Liquid Crystal Displays

Lee

2020

Polymers

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“…Their results showed the addition of nanoclay gives rise to the improvement of joint in impact loading. The characterization of the mechanical properties of nanoclay-filled epoxy adhesive single-lap joints was examined by Khalili et al [34]. Their results showed that the addition of an optimized percentage of nanoclay gave rise to improved joint under different conditions.…”

Section: Diffusive Adhesionmentioning

confidence: 99%

The effect of nanoparticles in single-lap composite joints studied by experimental and numerical analyses

et al. 2015

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“…The low electrical conductivity of epoxy resin (around 10 ‐7 ‐10 ‐14 S/m) limits its applications in the electrical industry . Recently, researchers used organic and inorganic fillers like graphene, micron or nano‐sized metal particles such as copper or silver, carbon nanotubes, clay, and nano‐carbon black to improve mechanical properties, adhesive strength, thermal properties, and electrical conductivity of epoxy adhesives . Depending on the filler loading level, the electrically conductive adhesives are categorized into three groups: isotropic, anisotropic, and nonconductive adhesive.…”

Section: Introductionmentioning

confidence: 99%

Electrically conductive epoxy‐based nanocomposite adhesives loaded with silver‐coated copper and silver‐coated reduced graphene oxide nanoparticles

Peighambardoust

Rikhtegar

Pakdel

et al. 2019

Polymers for Advanced Techs

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In this research, a conductive adhesive based on epoxy resin as the polymer matrix and silver-coated copper powder and silver-coated reduced graphene oxide as conductive fillers was synthesized. Graphene oxide was synthesized by modified Hummer's method. It was reduced and modified by silver powder. Copper particles were coated with silver using the electroless plating method. Finally, conductive nanocomposite adhesives were prepared using conductive fillers with different weight fractions. The structural properties of fillers were identified by Fouriertransform infrared (FTIR) and induced coupled plasma (ICP) analysis and the morphology of the samples by scanning electron microscopy (SEM). Finally, conductive properties, lap shear strength, and thermal stability of adhesive were evaluated. The conductive adhesive prepared with optimized properties have 70% weight percentage silver-coated copper powder and 1% weight percentage silver-coated reduced graphene oxide. The bulk resistivity of the optimum sample was 1.6 × 10 -2 Ω.cm, and the lap shear strength was 7.10 MPa. Also, thermogravimetric analysis showed that the weight loss of adhesive decreased from 88.72% to 30.55% during heating, which showed the addition of fillers improves the thermal stability of adhesive.

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Mechanical Properties of Nanoclay Reinforced Epoxy Adhesive Bonded Joints Made with Composite Materials

Cited by 50 publications

References 9 publications

Using Dihydrazides as Thermal Latent Curing Agents in Epoxy-Based Sealing Materials for Liquid Crystal Displays

Using Dihydrazides as Thermal Latent Curing Agents in Epoxy-Based Sealing Materials for Liquid Crystal Displays

The effect of nanoparticles in single-lap composite joints studied by experimental and numerical analyses

Electrically conductive epoxy‐based nanocomposite adhesives loaded with silver‐coated copper and silver‐coated reduced graphene oxide nanoparticles

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