Mechanical Properties of Thin Al Wires Prepared by Electromigration

Tohmyoh, Hironori; Akanda, Md. Abdus Salam; Nobe, Yuki

doi:10.1143/jpsj.81.094803

Cited by 5 publications

(6 citation statements)

References 26 publications

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“…Saka and Nakanishi 23) further developed this structure, and the scientific knowledge of the EM technique has been accumulated through examinations in a number of works. 5,25,36,37) With further investigation of the EM technique, the outstanding characteristics have been revealed as below. The EM technique can generate Al micro=nanomaterials with high aspect ratio, 23) high purity, 24) and single-crystal structure, 24) which contributes to a higher yield stress compared with that of bulk Al because there are few or no dislocations at grain boundaries.…”

Section: Problem Representationmentioning

confidence: 99%

“…5,23) The micro= nanomaterial fabricated by the EM technique has several unique properties, such as single-crystal structure, 24) that contributes to higher mechanical strength. 25) These characteristics of micro=nanomaterials fabricated by the EM technique would create original opportunities to develop some applications with remarkable abilities. The metal freestanding micro= nanomaterial synthesized by various approaches has a potential for large surface area electrodes, 26) electrochemical sensors, 27) microscopy probe tips 28) and thermal applications.…”

Section: Introductionmentioning

confidence: 99%

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Buried structure for increasing fabrication performance of micromaterial by electromigration

Kimura

Saka

2016

Jpn. J. Appl. Phys.

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The electromigration (EM) technique is a physical synthetic growth method for micro/nanomaterials. EM causes atomic diffusion in a metal line by high-density electron flows. The intentional control of accumulation and relaxation of atoms by EM can lead to the fabrication of a micro/nanomaterial. TiN passivation has been utilized as a component of sample in the EM technique. Although TiN passivation can simplify the cumbersome processes for preparing the sample, the leakage of current naturally occurs because of the conductivity of TiN as a side effect and decreases the performance of micro/nanomaterial fabrication. In the present work, we propose a buried structure, which contributes to significantly decreasing the current for fabricating an Al micromaterial by confining the current flow in the EM technique. The fabrication performance was evaluated based on the threshold current for fabricating an Al micromaterial using the buried structure and the previous structure with the leakage of current.

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Section: Problem Representationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Buried structure for increasing fabrication performance of micromaterial by electromigration

Kimura

Saka

2016

Jpn. J. Appl. Phys.

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“…The most commonly used microwire in MEMS technology is made of copper [7], NiTi [8], platinum [9], glass-coated magnetic microwire [10], silicon microwire [11,12], aluminum, gold microwire, etc. [13]. Due to the tiny size and high surface to volume ratio of the microstructures [5], the surface driving forces such as adhesion, stiction, electrostatic, electromagnetic, piezoelectric, magnetic, etc.…”

Section: Introductionmentioning

confidence: 99%

“…Without finding the reaction or contact forces between the microstructures and supports [6], the proper design and evaluation of the performance of MEMS devices and sensors are not possible [3,9]. For example, the manipulation of a microwire is challenging and difficult without knowing the contact frictional forces between the microwire and gripper to pick up the microwire from the substrate fabricated by Electromigration [13].…”

Section: Introductionmentioning

confidence: 99%

Numerical analysis of reaction forces at the supports of sliding microwire

Rahman

Akanda

2022

JMES

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The reaction forces at the tungsten support probes of a platinum microwire are determined by numerical analysis for different push-pull sliding velocities and contact pressures. The Finite Element Analysis (FEA) tool ANSYS Workbench is used to evaluate the contact stresses, reaction forces and deformations of the platinum microwire. The nonlinear contact analysis and contact formulations are implemented to ensure that the platinum microwire maintained contact with the tungsten support probes during push-pull sliding motion, and transfer frictional forces between contact surfaces without penetration and separation. The reaction forces at the support probes are found independent of the sliding velocity of the platinum microwire and vary with normal contact pressure. The results found in the numerical analysis are validated through experimental works. Due to the tiny size, the nonlinearity of contacts and indeterminate supports criteria, it is difficult to determine the reaction forces at the supports of a sliding microwire by conventional mechanics. The method of the numerical analysis of the sliding microwire presented in this paper can be used to determine the reaction forces of other microstructures, validate the experimental results, as well as to evaluate total disturbance forces in the microstructures where relative motion exists; which are important for the proper design and failure analysis of the MEMS devices and microstructures.

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“…By contrast, EM has been recently utilized to grow and fabricate metallic micro/nanowires (hereafter referred to as the EM technique). The micro/nanowires generated by the EM technique exhibit distinct characteristics, including a high aspect ratio, high purity, and monocrystalline structure that contribute to higher mechanical strength as compared to that of the bulk metal, which are caused due to little or no dislocations (Saka and Nakanishi 2006;Tohmyoh et al 2012;Kimura and Saka 2014). The growth location of an Al micro/nanowire can be controlled by intentionally introducing an artificial hole during passivation through which metallic atoms can be discharged.…”

Section: Introductionmentioning

confidence: 99%

Loss in discharging atoms through artificial hole for fabricating metallic micro/nanowire by electromigration

Kimura

2019

Mechanical Engineering Journal

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The electromigration (EM) technique is a method that is used to ensure the physical growth of metallic micro/nanowires. In the EM technique, the atomic diffusion of metals is intentionally accelerated by controlling the input current and heating the substrate, thus forming a hillock owing to the accumulation of atoms, which is transformed into small-diameter metallic micro/nanowires. The metallic micro/nanowires can be fabricated by discharging the atoms through a hole, which is artificially introduced in the passivation. The fabrication of metallic micro/nanowires has been successfully demonstrated using the EM technique, and the wire growth behavior is dependent on the characteristics of the artificial hole. However, very little information is available about the quantitative assessment of wire fabrication performance even though several experimental attempts have been conducted in prior studies. Additionally, the effect of structural parameters, such as the hole size, on the fabrication performance has not yet been adequately investigated. This study quantitatively evaluates the fabrication performance that is influenced by the hole size in terms of the growth rate of wires and threshold current used for fabrication. Based on the experimental results, the fabrication loss related to the hole size is experimentally revealed; further, an empirical formula for the fabrication loss has been developed. The optimal hole size to achieve the high performance of the micro/nanowire growth using the EM technique can be obtained with this finding.

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Mechanical Properties of Thin Al Wires Prepared by Electromigration

Cited by 5 publications

References 26 publications

Buried structure for increasing fabrication performance of micromaterial by electromigration

Buried structure for increasing fabrication performance of micromaterial by electromigration

Numerical analysis of reaction forces at the supports of sliding microwire

Loss in discharging atoms through artificial hole for fabricating metallic micro/nanowire by electromigration

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