2015
DOI: 10.2172/1187907
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Mechanical Response of Thermoelectric Materials

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Cited by 6 publications
(8 citation statements)
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References 108 publications
(174 reference statements)
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“…In addition, it is noteworthy that the tensile strength of Bi 2 Te 3 -based materials is difficult to measure owing to their brittleness, which usually results in fracture near the clamping fixture. The research on mechanical properties of Bi 2 Te 3 -based materials remains largely unexplored which is mainly ascribed to their sensitivity to flaws and their intrinsic brittle nature . Some typical strength-limiting flaws are presented in Figure , including edge-type, surface-type, and volume-type .…”
Section: Mechanical Response Of Bi2te3-based Materialsmentioning
confidence: 99%
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“…In addition, it is noteworthy that the tensile strength of Bi 2 Te 3 -based materials is difficult to measure owing to their brittleness, which usually results in fracture near the clamping fixture. The research on mechanical properties of Bi 2 Te 3 -based materials remains largely unexplored which is mainly ascribed to their sensitivity to flaws and their intrinsic brittle nature . Some typical strength-limiting flaws are presented in Figure , including edge-type, surface-type, and volume-type .…”
Section: Mechanical Response Of Bi2te3-based Materialsmentioning
confidence: 99%
“…Some typical strength-limiting flaws are presented in Figure , including edge-type, surface-type, and volume-type . Also, surface pitting, edge chipping, and delamination are among the common manufacturing flaws in zone-melted Bi 2 Te 3 -based materials . Modules assembled from these flaw-containing legs have significantly reduced reliability.…”
Section: Mechanical Response Of Bi2te3-based Materialsmentioning
confidence: 99%
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“…But the coarse grains and preferential crystal orientation render them in weak mechanical state, especially prone to cleavage along the van der Waal’s gap. This leads to the poor machinability, and thus various structural flaws appear in the manufactured TE legs, such as edge chipping, surface pitting, cracks, and lamellar cleavage . These defects are deleterious to the mechanical stability and reliability of module, especially making it difficult to manufacture microdevices.…”
Section: Introductionmentioning
confidence: 99%