Carbon-based nanoparticles
and conductive polymers are two classes
of materials widely used in the production of three-dimensional (3D)
piezoresistive sensors. One conductive polymer, poly(3,4-ethylenedioxythiophene):polystyrenesulfonate
(PEDOT:PSS) has excellent stability and conductivity yet is limited
in its application as a sensor, often existing upon a base, limiting
its performance and potential. Despite much progress in the field
of materials chemistry and polymer synthesis, one aspect we consider
worthy of exploration is the impact that microstructure and stiffness
may have on the sensitivity of 3D sensors. In this study, we report
a strategy for fabricating biphasic electroactive sponges (EAS) that
combine 3D porous PEDOT:PSS scaffolds possessing either an isotropic
or anisotropic microarchitecture, infused with insulating elastomeric
fillers of varying stiffness. When characterizing the electromechanical
behavior of these EAS, a higher stiffness yields a higher strain gauge
factor, with values as high as 387 for an isotropic microarchitecture
infused with a stiff elastomer. The approach we describe is cost-effective
and extremely versatile, by which one can fabricate piezoresistive
sensors with adaptable sensitivity ranges and excellent high strain
gauge factor with the underlying microarchitecture and insulant stiffness
dictating this performance.