2003
DOI: 10.1108/13565360310455526
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Mechanically fixed and thermally insulated micromechanical structures for GaAs heterostructure based MEMS devices

Abstract: A new micromachining technology of mechanically fixed and thermally insulated cantilevers, bridges and islands was developed to be used for design of GaAs heterostructure based microelectromechanical systems (MEMS) devices. Based on the micromachining technology, two different MEMS devices were designed and analyzed. The first one was micromechanical thermal converter (MTC) and the second one was a micromechanical coplanar waveguide (MCPW). The basic electro‐thermal as well as microwave properties of the MEMS … Show more

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Cited by 2 publications
(4 citation statements)
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“…Some of them are intended to help designers to collaborate or coordinate by sharing product information and manufacturing services through formal or informal interactions [8,26,51]. Others propose formalized frameworks that manage conflicts between design constraints and assist designers in making decisions [8,37,38,42]. There are also national-level efforts involving university and industry collaboration to make a variety of engineering services available over the Internet [29].…”
Section: Collaborative Design For Memsmentioning
confidence: 99%
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“…Some of them are intended to help designers to collaborate or coordinate by sharing product information and manufacturing services through formal or informal interactions [8,26,51]. Others propose formalized frameworks that manage conflicts between design constraints and assist designers in making decisions [8,37,38,42]. There are also national-level efforts involving university and industry collaboration to make a variety of engineering services available over the Internet [29].…”
Section: Collaborative Design For Memsmentioning
confidence: 99%
“…Recently, a novel bulk GaAs micromachining technology has been introduced [41,42]. It permits to fabricate very thin GaAs heterostructure based cantilevers and bridges fully compatible with the processing technology of GaAs pHEMT.…”
Section: Back Side Bulk Micromachiningmentioning
confidence: 99%
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