2023
DOI: 10.1021/acsanm.3c00384
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Mechanically Robust Nanoporous Polyimide/Silica Aerogels for Thermal Superinsulation of Aircraft

Abstract: Polyimide aerogels (PIAs) are thermally insulating materials that possess various advantages, such as exceptionally high temperature resistance and low thermal conductivity, which make them great potential candidate materials to be applied in the area of thermal protection. However, under harsh mechanical stresses, the macro- and microscopic structural stability of PIAs may be compromised due to shrinkage/collapse, leading to performance degradation. Herein, we propose a homogeneous organic/inorganic hybrid fo… Show more

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Cited by 23 publications
(6 citation statements)
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“…The actual temperatures of the hot stage were 51.6, 101. Compared with our previous work, the thermal insulation performance of PIAs-C decreased slightly at 150 C. 31 These results may be explained by the introduction of PUF increasing the pore size and density of PIAs-C. In general, the larger the pore size of aerogel, the higher the gaseous heat conductivity.…”
Section: Thermal Insulation Propertycontrasting
confidence: 68%
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“…The actual temperatures of the hot stage were 51.6, 101. Compared with our previous work, the thermal insulation performance of PIAs-C decreased slightly at 150 C. 31 These results may be explained by the introduction of PUF increasing the pore size and density of PIAs-C. In general, the larger the pore size of aerogel, the higher the gaseous heat conductivity.…”
Section: Thermal Insulation Propertycontrasting
confidence: 68%
“…Finally, APTES was added to the PI sol and stirred for 15 min, followed by aging, solvent exchanges, and supercritical CO 2 drying. The detailed preparation process is described in our previous work, and the obtained PIAs have linear shrinkage of 14.29%, bulk density of 0.150 g cm À3 and thermal conductivity of 0.0239 W m À1 K À1 at 25 C. 31…”
Section: Preparation Of Polyimide Hybrid Aerogelmentioning
confidence: 99%
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“…Polyimide (PI) resin is an organic material with extremely high heat resistance and can be widely used to manufacture composite structures that are resistant to temperatures as high as 300 °C [ 1 , 2 , 3 , 4 , 5 , 6 ], making it irreplaceable in the aerospace industry [ 7 , 8 ]. Among them, the heat resistance of phenylacetylene-capped polyimide resins can even reach 450 °C.…”
Section: Introductionmentioning
confidence: 99%
“…Polyimide (PI) resin is an organic material with extremely high heat resistance and can be widely used to manufacture composite structures that are resistant to temperatures as high as 300 • C [1][2][3][4][5][6], making it irreplaceable in the aerospace industry [7,8]. Among them, the heat resistance of phenylacetylene-capped polyimide resins can even reach 450 • C. They are capable of replacing aluminum alloy structures as resin-based materials in airplanes, missiles, and rockets, while reducing the weight by 15% to 30% [9].…”
Section: Introductionmentioning
confidence: 99%