Proceedings of the 28th International Workshop on Vertex Detectors — PoS(Vertex2019) 2020
DOI: 10.22323/1.373.0041
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Mechanics, readout and cooling systems of the Mu3e experiment

Abstract: Mu3e is an upcoming experiment at Paul Scherrer Institut in the search for the strongly suppressed decay of µ → eee. It will use an ultra-lightweight silicon pixel detector using thinned HV-CMOS MAPS chips. Multiple Coulomb scattering is further kept under control with using high density interconnects made of aluminium and operating the detector in a helium atmosphere. More than 1 m 2 of instrumented surface will produce about 3.3 kW of heat (≤ 250 mW/cm 2). Traditional cooling approaches are in conflict with … Show more

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Cited by 5 publications
(8 citation statements)
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“…The chips are glued onto the HDIs. The electrical connections between the HDI and the chip are made using single point tape automated bonding (spTAB) [12] and [13,Sec. 3].…”
Section: Vertex Detector Description and Test Setupsmentioning
confidence: 99%
“…The chips are glued onto the HDIs. The electrical connections between the HDI and the chip are made using single point tape automated bonding (spTAB) [12] and [13,Sec. 3].…”
Section: Vertex Detector Description and Test Setupsmentioning
confidence: 99%
“…The pixel sensors generate about 250 mW/cm 2 of heat. To remove this heat whilst keeping the material budget of the tracker sufficiently low, a gaseous He cooling system [10] is deployed providing well controlled He flows at atmospheric pressure between and outside the pixel layers.…”
Section: The Mu3e Detectormentioning
confidence: 99%
“…In the past, the general concept of detector construction and cooling was proven [9]. It was studied with a thermo-mechanical mock-up using aluminized polyimide tapes equipped with steel plates.…”
Section: Thermal-mechanical Mock-upmentioning
confidence: 99%