Mechanism for material removal in diamond turning of reaction-bonded silicon carbide

Yan, Jiwang; Zhang, Zhe; Kuriyagawa, Tsunemoto

doi:10.1016/j.ijmachtools.2008.12.007

Cited by 161 publications

(64 citation statements)

References 30 publications

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“…In partial ductile mode of silicon, the selfhealing of microcracks, microfractures and small spallings could take place by filling the defect cavities with the ductile metallic silicon phase in reality [36]. The material removal mechanism in diamond turning of reactionbonded silicon carbide involves ductile cutting, cleavage cracking and SiC grain dislodgement [37]. The material removal manner depends on the SiC grain size and depth and the grain boundaries bonding strength.…”

Section: Ductile Mode Cutting Mechanismmentioning

confidence: 99%

A review on ductile mode cutting of brittle materials

2018

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Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.

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Section: Ductile Mode Cutting Mechanismmentioning

confidence: 99%

A review on ductile mode cutting of brittle materials

2018

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“…[14]. Its value was calculated on the basis of the measured surface textures with the application of Photoshop Ò software.…”

Section: Surface Texture Measurementsmentioning

confidence: 99%

“…The research revealed that during ductile mode milling of tungsten carbide, the average surface roughness R a values were below 0.2 lm and independent of cutting speed and tool wear. Ultraprecision diamond turning of brittle reaction-bonded silicon carbide (RB-SiC) was carried out by Yan et al [14]. They stated that the mechanism for material removal involved ductile cutting, cleavage cracking, and grain dislodgement.…”

Section: Introductionmentioning

confidence: 99%

Surface texture formation in precision machining of direct laser deposited tungsten carbide

et al. 2017

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This paper focuses on an analysis of the surface texture formed during precision machining of tungsten carbide. The work material was fabricated using direct laser deposition (DLD) technology. The experiment included precision milling of tungsten carbide samples with a monolithic torus cubic boron nitride tool and grinding with diamond and alumina cup wheels. An optical surface profiler was applied to the measurements of surface textures and roughness profiles. In addition, the micro-geometry of the milling cutter was measured with the application of an optical device. The surface roughness height was also estimated with the application of a model, which included kinematic-geometric parameters and minimum uncut chip thickness. The research revealed the occurrence of micro-grooves on the machined surface. The surface roughness height calculated on the basis of the traditional kinematic-geometric model was incompatible with the measurements. However, better agreement between the theoretical and experimental values was observed for the minimum uncut chip thickness model.

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“…However, conventional diamond cutting is not applicable directly to steel materials due to extreme chemical tool wear [9]. Moreover, it is difficult to apply diamond cutting technology to hard and brittle materials machining because of the tool edge chipping and machined surface deterioration [10,11]. Recently, Wire-cut Electrical Discharge Machining (WEDM) is considered as one of the effective methods for the machining of difficult-to-cut materials.…”

Section: Introductionmentioning

confidence: 99%

Investigation of Micro Square Structure Fabrication by Applying Textured Cutting Tool in WEDM

Jian-guo

Zhang

et al. 2015

Micromachines

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This paper studies micro structure fabrication by means of a textured tool cutting edge, which is manufactured by applying the wire cut electrical discharge machining (WEDM). Machining performance of the square structure fabrication on the tool cutting edge is investigated in the WEDM process, and the machining accuracy is explored in experimental analyses. In this proposed method, undesired overcut comes from the discharge between the processing debris and the side wall of the target structure. Furthermore, by applying the textured cutting tool, the target square structure is directly fabricated on the alumina workpiece with just a simple turning process, which verifies the feasibility of the proposed tool cutting edge textured method by applying the WEDM. This technology is expected to become a potential method for the mass production of micro structure surfaces in the future.

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Mechanism for material removal in diamond turning of reaction-bonded silicon carbide

Cited by 161 publications

References 30 publications

A review on ductile mode cutting of brittle materials

A review on ductile mode cutting of brittle materials

Surface texture formation in precision machining of direct laser deposited tungsten carbide

Investigation of Micro Square Structure Fabrication by Applying Textured Cutting Tool in WEDM

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