Ultra-thin gate dielectrics processed by remote plasma nitridation (RPN) of N,O-grown oxides subsequently followed by NO RTA treatment (N,O+RF"+NO process) are reported for the first time as a means to extend the reliability scaling limit of SO,-i oxynitride-based gate dielectrics. These films show superior interface properties, significantly reduced leakage current, and improved reliability compared to other gate dielectrics of similar thickness (-1.4 nm) fabricated by different processes.