2019
DOI: 10.3390/mi10100696
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Mechanism of Unstable Material Removal Modes in Micro Cutting of Silicon Carbide

Abstract: This study conducts large-scale molecular dynamics (MD) simulations of micro cutting of single crystal 6H silicon carbide (SiC) with up to 19 million atoms to investigate the mechanism of unstable material removal modes within the transitional range of undeformed chip thickness in which either brittle or ductile mode of cutting might occur. Under this transitional range, cracks are always formed in the cutting zone, but the stress states cannot guarantee their propagation. The cutting mode is brittle when the … Show more

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Cited by 6 publications
(4 citation statements)
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“…When an RSR is integer, the circular waviness profiles can be mathematically described by Equation (11), whose period and amplitude can be calculated by Equations (12) and (13). When RSR is non-integer and the wave-shift value T θ = 1 q , the circular waviness profiles can be mathematically described by Equation 14, whose period and amplitude can be calculated by Equations (15) and (16). Based on the Equations (11)- (16), the circular waviness profiles on the edge of each circle surface of the Fresnel micro-structured mold can be illustrated, as shown in Figure 8a,b and Figure 8c,d, representing the integer RSR and non-integer RSR, respectively.…”
Section: Modeling Of the Circular Waviness Profilesmentioning
confidence: 99%
See 1 more Smart Citation
“…When an RSR is integer, the circular waviness profiles can be mathematically described by Equation (11), whose period and amplitude can be calculated by Equations (12) and (13). When RSR is non-integer and the wave-shift value T θ = 1 q , the circular waviness profiles can be mathematically described by Equation 14, whose period and amplitude can be calculated by Equations (15) and (16). Based on the Equations (11)- (16), the circular waviness profiles on the edge of each circle surface of the Fresnel micro-structured mold can be illustrated, as shown in Figure 8a,b and Figure 8c,d, representing the integer RSR and non-integer RSR, respectively.…”
Section: Modeling Of the Circular Waviness Profilesmentioning
confidence: 99%
“…In order to achieve large-scale and low-cost production, it is currently vigorously developing replication processing technologies such as glass molding [9][10][11][12], whose key component is Fresnel micro-structured mold. The mold material used for glass molding is mainly hard-brittle material such as silicon carbide (SiC) and tungsten carbide (WC) [13][14][15]. Ultra-precision grinding is the preferred manufacturing technology to achieve the high-precision requirements for hard-brittle components [16][17][18][19][20][21].…”
Section: Introductionmentioning
confidence: 99%
“…Wen Gu et al improved the assessment of the brittle-ductile transition based on the surface conditions using a method of changing the position to observe the two-dimensional plane with an optical microscope and then calculating the BDTD of the material by extracting the envelope curve [ 19 ]. Three-dimensional microscopic measurement methods mainly use a scanning electron microscope (SEM), atomic force microscope (AFM), transmission electron microscope (TEM), etc., as well as a white light interferometer, laser confocal measuring instrument, or other three-dimensional scanning equipment for performing measurements; then, according to the three-dimensional information, the position of the brittle-ductile transition point is judged, and the BDTD is obtained [ 20 , 21 , 22 , 23 ]. For example, Fang et al used an SEM and AFM to observe a surface after taper cutting and obtained the critical cutting thickness of the brittle-ductile transition during the nano-cutting of single-crystal silicon [ 24 , 25 ].…”
Section: Introductionmentioning
confidence: 99%
“…Researches [21,22] established that the main reason for residual stresses is the high variation of the hardness value of the minerals within the material. Recent research is based on the application of molecular dynamics simulations to establish correlations between stress/machining conditions and crack growth [23].…”
Section: Introductionmentioning
confidence: 99%