2006
DOI: 10.2172/910596
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Mechanisms for fatigue and wear of polysilicon structural thinfilms

Abstract: This suggests a predominantly abrasive wear mechanism, controlled by fracture, which commences by the first particles created by adhesive wear.

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“…In addition, the etching process by itself removes sharp edges which results in more resistance to initiate cracks and fatigue failure. According to Alsem [104], the fatigue lifetime of polysilicon thin film structures is more than 10 11 cycles when the maximum stress is in 70% of the fracture strength. In this case, the maximum stress reaches less than 20% of the fracture stress and can be interpreted as a safe limit for fatigue failure.…”
Section: Verification Of Performancementioning
confidence: 99%
“…In addition, the etching process by itself removes sharp edges which results in more resistance to initiate cracks and fatigue failure. According to Alsem [104], the fatigue lifetime of polysilicon thin film structures is more than 10 11 cycles when the maximum stress is in 70% of the fracture strength. In this case, the maximum stress reaches less than 20% of the fracture stress and can be interpreted as a safe limit for fatigue failure.…”
Section: Verification Of Performancementioning
confidence: 99%